Check out the new Samtec Cable Group Tech Center video. It’s an overview of the Samtec Cable Group, our R&D and manufacturing Technology Center focusing on precision extruded micro coax and twinax cable used for high speed / high density cable assemblies, including 26-38 AWG, 50/75/85/100 ohm impedance, and systems rated at 28+ Gbps. Cable Options Samtec Cable Group offers a variety of center conductor, dielectric, shielding, and jacket options. Center conductor options include … [Read more...]
Samtec and Amphenol® Aerospace Partner to Address the Growing Need for Rugged Optics
Samtec and Amphenol® Aerospace recently announced a partnership to incorporate Samtec’s FireFly™ optical cable platform with Amphenol® Aerospace’s bulkhead interconnects for rugged optic solutions. Click here to read the official press release. FireFly™ Samtec’s FireFly™ is a mid-board cable and optical interconnect system. FireFly™ is incredibly dense, and it enables chip-to-chip, board-to-board, and system-to-board connectivity using the same connector system for both copper … [Read more...]
Dense, Rugged, and Fast: This Is A Cable Assembly, Not Your Daughter’s Boyfriend
Samtec’s new SEARAY™ 0.80 mm pitch ultra-high density array cable assemblies provide 50% board space savings compared to 1.27 mm pitch systems. With performance to 15 Gbps and up to 300 total Edge Rate® contacts, this cable system is designed for rugged high speed applications where space is limited. High Speed Cable Assembly SEARAY™ 0.80 mm pitch array cable assembly -- the ESCA Series -- offers 50Ω single ended signal routing on 34 AWG micro ribbon coax cable, and it supports PCIe® … [Read more...]
New SEARAY™ High Density Press Fit Right Angle Socket
Samtec’s SEARAY™ high density, high-speed array interconnect is now available in a right angle, press-fit design. SEARAY™ The SEARAY™ high speed array system is a 1.27 mm pitch open pin field array for maximum grounding and routing flexibility. It is available with up to 500 I/Os, and the rugged Edge Rate® contact has low insertion and withdrawal forces to simplify pcb handling. SEARAY® is an Extended Life Product™ (ELP) and has passed 10 year mixed flowing gas (MFG) and high … [Read more...]
The Sky’s The Limit — New Elevated, High Speed Mezzanine Interconnect System
SkyRay™, Samtec’s new elevated, high density array interconnect system, offers design flexibility and high bandwidth performance without sacrificing signal integrity. The high speed system supports 28+ Gbps applications, as well as PCIe® and XAUI specifications. SkyRay is designed for high speed elevated board stacking, with stack heights ranging from 18 mm to 40 mm. The standard stack height is 35 mm. SkyRay is ideal for applications that generate higher levels of heat … [Read more...]
PCIe® Gen 3 Protocol Over Fiber
Samtec PCIEO Series Active Optical Cable Assemblies use a patented optical engine technology allowing low power consumption while significantly extending the PCIe® bus. These Active Optical Cable Assemblies allow new and existing PCIe® Expansion and Extension systems to extend the distance between ports up to 100 meters at Gen 3 data rates. The cable length can be easily customized with either a 100 MHz clock or with no clock. These Active Optical Cables are plug-compatible, … [Read more...]
PCB Materials For Terabit Backplane Designs
Samtec helps engineers design high performance electronic systems. With the recent integration of Teraspeed® Consulting into the Samtec family, we now provide more access to our advanced systems design research, helpful videos, conference presentations, white papers, etc. Here’s a link to two videos you should check out. Scott McMorrow, an R&D Consultant for Teraspeed® Consulting, explains how he performed extensive analyses of PCB materials for terabit backplane designs. His … [Read more...]
Advice On Selecting and Processing Connectors
If you're reading this, chances are you work with board level interconnects and are familiar with design and processing issues that affect them. If your job doesn’t require you to work with connectors, but you’re still reading this, then you are probably messed up and need some type of professional help. Assuming you're in the first group, check out the list below. This is from Phil Eckert, Samtec’s Customer Quality Engineering Manager. Phil’s career includes connector design, quality … [Read more...]
New 1.00 mm Pitch Ultra Low Profile, Ultra High Density Interposer
Samtec’s Z-Ray® one piece arrays are ultra-low profile, high density and highly customizable. These compression contact arrays are used as interposers or as board level interconnects. Compared to standard interposers, they feature greater density, X-Y-Z axes flexibility, customizable shapes and patterns, increased cycle life, low normal force with high deflection range and 28+ Gbps performance. The new 1.00 mm pitch arrays (ZA1 Series) expand the Z-Ray® interposers product line … [Read more...]
Direct Connect High Speed Press Fit Cable Assembly
Our new DCC Series -- direct connect cable system – is a cost-effective high speed cable solution that supports and surpasses PCIe® Gen3 speeds at 2 meters cable length. The DCC is rugged. High retention press fit pins attach directly to the PCB, eliminating the cost of the mating connector. Fortunately an extraction tool is available. The assembly also has an over-molded strain relief. The connector saves space. First, it is low profile, only 3,00 mm tall. Second, it also saves space … [Read more...]