The foundation is a simple but high-performing SMT two-piece connector set. It connects to both copper and optical cable assemblies. It can support 56 Gbps PAM4 data rates over long ranges.
Next-Gen App: 56 Gbps PAM4 FireFly
So what are the latest trends in on-board optics? One trend sweeping the industry continues to be 56 Gbps PAM4 data rates. As more high-speed silicon solutions (FPGAs, CDRs, SerDes, etc.), becomes available, the demand for high-speed optics will only increase.
In response, Samtec currently has 56 Gbps PAM4 FireFly options under development. This technology was recently demonstrated at OFC 2019.
The demo showcases low latency, high performance, on-board optical engines transmitting at 56 Gbps PAM4 per channel. The FireFly copper and optical options offer a direct connection into the ASIC/FPGA package, bypassing the PCB for improved density and performance.
Next-Gen App: Extended Temperature FireFly Optics
The ETUO series shares the core features of Samtec’s existing ECUO series. Both are designed for flexibility and are interchangeable with the FireFly™ copper assemblies using the same connector system.
However, the new ETUO series support temperature ranges of -40°C to +85°C. Other key features of ETUO include:
- High-speed performance to 10.3125 Gbps per channel
- x4 duplex, x12 simplex, x12 duplex optical transceiver system
- Integral heat sink provides optimal cooling for thermal operating conditions
- These key features enable up to 123.75 Gbps aggregate data rate.
Next-Gen App: New Chalk Talk
What about other applications? Fortunately, additional details are included in the latest Chalk Talk from Samtec and EE Journal. FireFly offers many benefits – speed, reliability, or EMC improvements to name a few.
This new Chalk Talk gives designers fluency on the world of optics. It also examines how to use high-speed, high-reliability optics solutions in next-gen applications.
For more information, please download the recently updated Firefly Application Design Guide.