Samtec is pleased to announce a series of new ChalkTalk On-Demand Webcasts featuring a variety of Samtec Silicon-to-Silicon High-Performance solutions. Samtec has partnered with EEJournal to offer an additional channel of technical education on Samtec’s next generation high-performance solutions.
New Samtec Characterization and Development Kits
With today’s high-performance designs, signal integrity and connectors have become a major design consideration. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns from Samtec about new development kits that can help tame your SI and connector problems.
Throughout 2018, Samtec will be expanding its portfolio of interconnect solution supporting 56 Gbps PAM4 and beyond data rates. As the ChalkTalk shows, new characterization and developments its are becoming available. For more information, please download Samtec’s new Silicon-To-Silicon Application Solutions Guide.
ANSI/VITA 57.4-2016 FMC+ — The New Frontier of FPGA Expansion Cards
FPGA Mezzanine Cards (FMC and FMC+) allow easy connection of a wide variety of peripherals to FPGA development boards. But, FMC – and particularly FMC+ put big demands on connector technology. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns of Samtec about FMC and FMC+ standards and the connectors that make them work.
Mid-Board Optics: An Alternative to Pluggable MSA Solutions
How would you like to upgrade from copper to optical flyover – all with the same connector system? In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns from Samtec about Firefly – a future-proof high-density flyover system.
For more information, please download the recently updated Firefly Application Design Guide.
High-Speed Backplane Connectors Drive 56 Gbps and Beyond
Is your backplane design taking you to 56 Gbps and beyond? Today’s faster backplane speeds require faster connectors. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns from Samtec about the newest, fastest backplane connectors available.
For more information, please download the High-Speed Board-To-Board Application Design Guide.