2016 was an exciting year for Samtec, with several major product releases, a few major software and website releases, and a couple of significant company acquisitions.
We’ve done our best to detail all of it and more on The Samtec Blog, along with several pieces of content to help you solve your design problems along the way.
Here are our top 11 most popular articles of 2016. Enjoy!
In May of 2016, Samtec acquired two bleeding edge companies, nMode Solutions and Triton Microtechnologies.
Through capabilities such as nMode Smart Modules and Glass Core Technology, Samtec is significantly furthering its strategy of helping designers optimize the high-speed signal path from the bare die, to IC package and assembly, to the PCB, to connectors and cable assemblies, and back again,” said Steve Groothuis, Chief Technology Officer of Samtec Microelectronics.
Galvanic corrosion, while not the most sexy topic to write about, is a hot topic in the interconnect processing world, as it has a huge effect on the quality of end applications.
This article, in collaboration with our interconnect processing group, details how to avoid potential galvanic corrosion by making the correct material choices during the design process.
Electrical noise can wreak havoc on any electronic system. In this article, we provide several guidelines to help you design your systems to ensure electromagnetic immunity.
This was a huge year for 3D model capabilities on Samtec.com. With the release of our new dynamic 3D model generator, which allows you to configure, request, and download a 3D model across 100 different formats in under a minute, we’re now delivering over 1,000 3D models each business day.
Best of all, these models are all available without a single bit of personal information required, not even an email address.
Our FireFly™ Micro Flyover System™ has been one of our most popular new products in our recent history.
The newest version, released in November of this year, extended the operating temperature of the system, increasing the flexibility and feasibility of the system significantly.
In May of 2016, Samtec entered into a license agreement with Amphenol for several backplane connector families, bringing a wide array of potential backplane capability to the future of Samtec products.
In another collaboration with our processing group, we posted this article back in May to outline several guidelines and best practices for Paste-In-Hole processing.
The PCIe 4.0 standard is quickly approaching. In this post, we announced that our FireFly™ Micro Flyover System™ fully supports PCIe 4.0, making it a go-to candidate for systems designed to use this standard.
At the OFC show in April, we set up a demo of an optical interconnection between two FPGAs using our FireFly™ 14 Gbps optical link in an FMC VITA 57.1 form factor.
Kevin Burt of the Samtec Optical Group is interviewed and discusses this demonstration in this popular video post.
In May of 2016, Eric Bogatin shared three predictions on the state of signal integrity. This post discusses those predictions and how Samtec products can help solve the issues they may cause.
One of the most highly requested features from users of Samtec.com has been for a parametric search to help them sort through our trillions of different possible product configurations.
In September, our web team finally fulfilled this request with Solutionator 2.0, a full-fledged parametric search featuring nearly 1 million possible product configurations (and counting).
We’ll See You in 2017!
From all of us at Samtec, we want to sincerely thank you for following along with The Samtec Blog this year and since its launch.
Without you coming back again and again to read each and every post (you do read every post right?), none of this would be worthwhile. We genuinely appreciate your readership and your business!
We’re incredibly excited about what is developing for next year and cannot wait to get to share it all with you.
Have a safe and happy New Year and we’ll see you in 2017!