See Samtec 224 Gbps Demos at DesignCon
Samtec has been developing numerous options for leading-edge interconnect designs that support 224 Gbps. At DesignCon 2025, being held January 28-30 in Santa Clara, CA, you can speak with Samtec experts to learn about these new interconnects as well as established products and technologies that support data rates up to 224 Gbps PAM4 and signals up to 110 GHz.
Samtec engineers will be in DesignCon booth #939 to help designers find the optimal interconnect solution–whether it be copper or optics; connectors, cable systems, or discrete wire; RF or digital. To meet Samtec at DesignCon, you can register with the Samtec VIP code: INVITE977339 to receive a free Expo Pass or 15% discount for conference passes.
If you won’t be at the show, you can reach out directly to Samtec signal integrity experts and engineers at [email protected]. Here are some of the places you will find the Samtec team at DesignCon 2025:
Booth 939 Wednesday and Thursday
Visit Samtec in Booth #939 to meet with our team members who are advancing standards development and pushing the state of the art to deliver the best signal and power integrity performance, whether your system involves fiber optics, RF signals, or digital signals operating at 56 Gbps, 112 Gbps, or 224 Gbps.
Samtec’s world-renowned engineering team has been examining the challenges of 224 Gbps design and developing product and technology solutions. We look forward to showing you our new Si-Fly® HD connectors operating at 224 Gbps.
Other booth demonstrations include Samtec’s NitrowaveTM RF cable and new NovaRay® backplane system operating at 112 Gbps. Stop by and see the 56 Gbps active optics demonstration incorporating Samtec’s FireFlyTM and new HaloTM products.
Around the Show Floor
Samtec products will also be featured in demos with our partners throughout the show floor. As you make your way around the expo, be sure to stop and see the technologies on display at Rohde & Schwarz (Booth #949) and Keysight (Booth #1039).
Technical Conference Sessions & Panels
Samtec engineers will be participating as authors and/or speakers in 10 papers, panels, and sponsored sessions throughout the conference. Don’t miss this chance to connect with Samtec experts at DesignCon 2025! Here are some details to help you plan your time:
Tuesday
4:45-6:00: Panel PCI Express & PAM4: Balancing Silicon & Interconnect Interdependencies for 128 GT/s Steve Krooswyk, Samtec, et al.
Wednesday
11:10-11:50: Validate 224/448 Gbps PAM4 Multi-Channel SerDes with Novel Testing Solutions Anthony Felbaum, Samtec, Great America Ballroom 2.
12:15-1:00: Paper: Reduced Order Geometric Macro Model of PCB Fiberglass Spatial Variation for Skew & Impedance Prediction Scott McMorrow, Samtec.
2:00-2:45: Paper: Transmitter Power Spectral Density Noise Impact for 200 Gb/s PAM 4 per Lane Brandon Gore & Richard Mellitz, Samtec, et al.
2:00-2:45: Panel: Expert Discussion: How Will AI Applications Affect High Speed Link Design? Scott McMorrow, Steve Krooswyk, Jignesh Shah, Samtec.
Thursday
8:00-8:45: Paper: Direct to Substrate 200G-PAM4 Co-Packaged Connectors: Is it a Reality? Jignesh Shah & Steve Krooswyk, Samtec, et al.
12:15-1:00: Paper: Beyond 200G: Brick Walls of 400G links per Lane Brandon Gore, Andrew Josephson, & Richard Mellitz, Samtec, et al.
2:00-2:45: Paper: Accurate Adapter Removal in High Precision Low Loss RF Interconnect Characterization Mick Zhou, Jason Sia, and Tony Chen, Samtec, et al.
3:00-3:45: Paper Determining the Requirements, Die vs Package vs Board: Multi-Level Power Distribution Network Design Istvan Novak, Samtec, et al.
Get a Preview!
Check out Matt Burns and Scott McMorrow’s discussion with Judy Warner on an upcoming EEcosystem podcast.
More Information
Samtec Si-Fly HD Connector Supports 224 Gbps PAM4 with Excellent Performance – The Samtec Blog
How to Improve Signal Integrity for 224 Gbps Test Systems (Part 1) – The Samtec Blog
New 224 Gbps PAM4 Interconnect Solutions With Impressive Performance – The Samtec Blog
