Surprise! Another virtual tradeshow. Who knew? COVID-19 and “2020” strike again! This time we are off to SC20, which takes place November 17-19, 2020.
HPC is the underpinning for many of today’s most exciting new research areas, from machine learning to artificial intelligence to quantum computing. Scientists, researchers, and data analysts from academia, industry and government agencies will be center stage at SC20.
Accelerating HPC via Silicon-to-Silicon Solutions
“HPC system designers and developers are challenged with balancing increasing throughput, scalability and density demands with cost and time-to-market,” said Ralph Page, Sr. System Architect for Samtec, Inc. “Samtec and its partners help address these challenges with industry-leading design expertise, system optimization, and innovative solutions meeting next-gen performance expectations.”
Samtec’s diverse product and technology portfolio provides system designers architectural solutions to the challenges faced by the industry. Several key solutions will be featured during the SC20 via the Exhibitor Forum, Virtual Demos and Featured Products.
SC20 Exhibitor Forum
Samtec’s own Brian Niehoff will present a very interesting topic during the Exhibitor Forum portion of SC20. His topic is Thermal Management of HPC Hardware Architectures via Immersion Cooling.
As computing power continues to increase, air cooled systems can not meet current thermal requirements for HPC hardware systems. Power consumption, space and performance all must be considered during system design.
Immersion cooling is a fast-growing solution to economically combat system heat, noise, power consumption and compute density. In this presentation, Samtec will discuss both novel immersion cooling techniques and observed results from testing across its interconnect product portfolio.
SC20 Virtual Demonstrations
- PCIe® 4.0 Over Fiber Adapter Card: Samtec and Dolphin
- UCLA’s Ocean High-Throughput Processor in the CMS Experiment at the CERN Large Hadron Collider
- Thermal Management of HPC Hardware Architectures via Immersion Cooling
- PLDAs latest PCIe® 5.0 Evaluation and Development Platform
We also have several product-based demos detailing our bleeding edge 112 Gbps PAM4. For mores details, please visit www.samtec.com/sc20.
SC20 Featured Products
One goal many SC20 attendees have is to see what’s new from a product and technology standpoint. While this provides many challenges in a virtual event, the high-speed demand of the HPC industry are not slowing down.
Key Samtec high-performance interconnect solutions will be featured at SC20. From front-panel to the backplane, HPC system designers can count on key solutions from Samtec including:
- Si-Fly™ 112 Gbps PAM4 Low-Profile High-Density Cable System
- NovaRay® 112 Gbps PAM4 Extreme Density Arrays
- FireFly™ Micro Flyover System™
- AcceleRate® HD, AcceleRate® HP and AcceleRate® Cable Interconnect Solutions
For more details, please visit www.samtec.com/sc20.
We look forward to seeing you as the show. Please stop by our virtual booth during the event.