Samtec is pleased to announce the new Silicon-to-Silicon Application Solutions Guide. This updated guide details the evolution of Samtec technologies, products and technical support available for next-gen system data rates.
56 Gbps PAM4. 56 Gbps NRZ. 112 Gbps PAM4. Whatever the data rate, Samtec’s Silicon-to-Silicon ecosystem of SI expertise, system design and testing, high-performance validation and online design tools offer customers an ideal development partner.
Samtec Differentiators for Next Generation Systems
As data rate requirements approach and surpass 56 Gbps, developers are challenged with balancing increasing throughput, scalability and density demands with concerns such as power consumption, signal integrity, cost and time to market.
The new guide demonstrates how Samtec can help address these challenges. Specific topics covered include:
- High-Speed Interconnect Expertise (e.g. technologies, products, support)
- High-Performance SI Characterization Testing & Validation (i.e. high-level design assistance and engineering)
- Online Design Tools & Resources (e.g. Channelyzer, Solutionator, Simulator)
Beyond 56 Gbps Products, Technologies and Systems
Each section of the new guide includes an overview of key products or technologies. It also offers performance data and examples of customer development platforms that leverage Samtec products.
- High-Speed Backplane
- High-Speed Mezzanine
- Twinax Flyover™ Systems
- High-Performance Optics
- Advanced Microelectronics
- Precision RF / Test
Samtec SI Characterization Kits
Designing and evaluation high performance interconnect systems present engineers many technical challenges. From concept and prototype to development and production, Samtec-designed Characterization and Development Kits featuring high-speed interconnect solutions simplify design and reduce time to market for hobbyists, tinkerers, start-ups and OEMs alike.
Samtec makes it easy for customers to evaluate application-specific Samtec interconnect systems. Samtec’s growing portfolio of SI Characterization Kits reflects the plethora of new interconnect solutions introduced in 2018.
Here are a few of the new SI Characterization Kits Samtec now offers.
- NovaRay™ Extreme Density Array (NVAM / NVAF Series)
- Flyover™ QSFP-DD with a choice of End 2 options (AcceleRate™, NovaRay™)
- LP Array™ Low Profile Array (LPAX Series)
- Endless options for customized kits
For more information, please download the new Silicon-to-Silicon Application Solutions Guide, visit the Samtec Silicon-to-Silicon microsite or e-mail Samtec’s technical experts at KitsAndBoards@samtec.com.