Samtec’s Active Product Demonstrator proves 56 Gbps PAM4 based systems are fully realizable today. It’s a state-of-the-art prototype combining high-performance interconnects from Samtec and bleeding edge Credo silicon. All interconnect and silicon shown are available.
The Demonstrator internally generates over 100 independent channels of signal data using Credo mixed-signal 56 Gbps PAM4 SERDES Bald Eagle silicon. Each signal generated is QPRBS 31, 56 Gbps PAM4 data, equivalent to 5.8 Tbps of aggregate throughput.
Each signal is generated by a Credo SERDES, then passes through one or more Samtec connectors, before being received by another Credo SERDES, which measures bit error rates, insertion loss, eye height and diagrams, all in real-time. Ralph quickly reviews the performance of each interconnect system; most have BER’s of e-11 to e-16. Channels based on Accelerate mezzanine and Accelerate cable operate with pre-FEC BERs of zero (!).
The point being, this is a fully-packaged system that fully populates signal paths, and uses real-world signal integrity design practices, automated design processes. It demonstrates 56Gbps PAM 4 signaling targeting OIF and IEEE standards passing through Samtec mezzanine and Samtec Flyover products.
The demonstrator includes many of our high-speed interconnect systems, including:
ExaMAX® High-Speed Backplane system: Samtec ExaMAX enables 56 Gbps electrical performance on 2.00 mm column pitch. ExaMAX meets industry specifications such as PCI Express®, Intel OPI and UPI, SAS, SATA, Fibre Channel, Infini Band™ and Ethernet. In addition to traditional backplane configurations, the direct-mate orthogonal design eliminates the need for a backplane/midplane and shortens the signal path for improved sgnal integrity.
The ExaMAX contact system achieves two reliable points of contact at all times and minimizes residual stub for improved signal integrity performance, while providing low mating force and excellent contact normal force. Signal wafers incorporate a one-piece, embossed ground structure which improves crosstalk performance.
Samtec Flyover® QSFP28 Double Density Cable system: The Samtec Flyover QSFP System provides improved signal integrity and architectural flexibility by removing critical high-speed signals from lossy PCB materials and routing them directly to the panel via ultra low skew twinax cable. The ultra-high-density design includes sideband signaling via press-fit contacts to help increase airflow, and a multitude of “End 2” options allow for maximum design flexibility.
.635 mm pitch AcceleRate® Slim Body Cable assembly: AcceleRate features an extremely slim 7.6 mm width and Eye Speed® ultra-low skew twinax cable with direct attach to the contacts. This eliminates the need and variability of a transition card for improved signal integrity. The cable system also supports Samtec Flyover technology, which simplifies board layout and extending signal reach.
AcceleRate Ultra-Dense Mezzanine system: AcceleRate is an incredibly dense board-to-board interconnect system with up to 240 total I/Os, a slim 5 mm width footprint, and a low profile 5 mm stack height. The four row design is available in 10 – 60 positions per row (40 – 240 total positions), with Samtec Edge Rate® contact system optimized for signal integrity performance.
For more information please contact the Signal Integrity Group.
