The Flash Memory Summit (FMS) is up and running this week in Santa Clara, CA. The event gives attendees access to the latest technology updates, forecasts, and roadmaps from NVM industry leaders.
FMS 2019 is a great venue for the Gen-Z Consortium to display its latest solutions. Gen-Z technology offers a secure open-systems fabric providing high-speed, low-latency access to all memory types in a system.
At FMS, the Gen-Z Consortium will highlight a multi-vendor rack typical of modern data centers. The demo includes:
- Outside-the-box modular, pluggable DRAM drives
- New Gen-Z media box architecture
- Open-source software
- Connector solutions
- Introduction of the new 3.0” 256GB Gen-Z modular form factor
All Gen-Z Consortium demonstrations will be in booth #739 at FMS.
Gen-Z Media Box Includes Samtec Flyover ® Technology
The whole concept of Gen-Z is to simplify and enhance the access to every device in a system. This requires a Gen-Z Switch to direct traffic between MCUs, GPUs, SSDs, DRAM, and other system elements.
The Gen-Z Media Box demo at FMS uses an FPGA-based High-Speed Communications Hub as the Gen-Z Switch. The FPGA uses Gen-Z IP to build the fabric between the various devices in the media box and the system.
The Gen-Z switch connects throughout the media box using Samtec Flyover® technology. Samtec Flyover cable assemblies easily route high-density, high-speed Gen-Z fabric throughout the media box.
Samtec Flyover® systems can help extend signal reach and density to achieve next gen speeds by routing signals via ultra-low skew twinax cable versus through lossy PCB.
As bandwidth requirements rapidly increase, effectively managing heat and routing signals through lossy PCBs, vias and other components have become complex challenges.
Samtec Flyover® design breaks the constraints of traditional signaling substrate and hardware offerings, resulting in a cost–effective, high-performance and heat efficient answer to the challenges of 56 Gbps bandwidths and beyond.
Samtec Flyover® design provides end option flexibility to create a high-speed application-specific solution – like Gen-Z Media Boxes – to meet next gen speeds. Cable assembly types include:
- Front-panel to mid-board
- Backplane to mid-board
- Front-panel to backplane
For more information, please visit www.samtec.com/flyover.