Connectors For High Cycle, Harsh Environment Applications Let’s have a show of hands. If you specify board level interconnects, how many of you require your interconnect system to be rated at 2,500 cycles or more? Most board level interconnect applications require far less than 100 cycles over their lifetime, but obviously there are exceptions. Those exceptions range from 150 cycles to 2,500 to 10,000. If your application falls into the latter category, you should know about Samtec … [Read more...]
Samtec SEARAY™ High Density Arrays Continue to Expand
Samtec has a long history of developing mezzanine interconnect solutions that meet and exceed our customer’s expectations. Our legacy revolves around standard board-to-board connectors used in applications ranging from TV remotes to MRI machines. Our depth of solutions has grown as time has passed, but one family of products offers the density, performance and flexibility to support many high-speed board-to-board applications. SEARAY™ High-Density Open Pin Field Array's many features and … [Read more...]
One of A Kind – One Piece Board-to-Board Interconnects
Board-to-board interconnect systems come in all shapes and sizes. Obviously, selecting the right interconnect set for your application is paramount to success. Designers need to choose products that meet their size, shape, mechanical, and electrical requirements. Two-piece interconnect sets, with a terminal that interfaces with a socket/receptacle, are the most common application. Rugged For designers who need micro pitch interconnects in a rugged, high shock and vibration … [Read more...]
Board Stacking Interconnects For Unusual Applications
Samtec has more ways to connect two or more boards than any other interconnect provider. This blog discusses board stacking interconnects that are a little different than your standard mezzanine configuration, but offer solutions when you have design constraints that can be difficult to work around. Connect Three (or more) Boards A board stacking strategy employed by many Samtec customers is “pass-through.” A common pass-through application is connecting three pcbs (or more) … [Read more...]
NXP SCM Demo Features Samtec Interconnect
Increased functionality in everyday devices continues to drive the innovation in the electronics industry. From the growth in camera drones to smart glasses and robots, consumers today demand more of the purchases they make. Traditional electronic designs are multi-chip solution featuring microprocessors, memory, power, IO and other essential system functionality. Design cycles last from months to years depending on complexity. Legacy design approaches prove inefficient for … [Read more...]
Selecting The Right Contact For Your Board-to-Board Interconnect System
Many Samtec blogs discuss bleeding edge new technologies, new products, or provide guidelines on optimizing system performance. Having said that, one of our biggest selling product lines is standard pitch (2.54, 2.00, 1.27 mm) board-to-board interconnects. These are not as sexy as using an ultra-high-density interconnect with PAM4 to achieve 56 Gbps serial channels, but they look mighty appealing if your job is to identify and design-in reliable board-to-board interconnect systems. Samtec has … [Read more...]
Samtec Expands Support of PCI/104-Express™ Systems
In the mobile world we live in, many view products based on the X86 microprocessor architecture as technology from a bygone era. However, X86 solutions abound in many everyday applications from our desktop and laptop computers to the servers and network solutions found in modern data centers. Another area where X86 solutions abound is embedded computing applications. More than 20 years ago, the computing industry established a common vision of adapting desktop computer technology for … [Read more...]
Amphenol and Samtec Sign License Agreement for Backplane Interconnect Products
Licensing agreement brings electronics equipment manufacturers a reliable new supplier of Amphenol’s high performance backplane connectors Nashua, NH, May, 2016 -- Amphenol, the leading provider of high performance backplane interconnect systems, and Samtec, Inc., a leader in interconnect systems and signal integrity consulting, have entered into license agreements for several backplane connector families. Under the agreements, Amphenol will license its intellectual property and detailed … [Read more...]
Samtec Releases Micro Discrete Wire Application Design Guide
Wire-to-board connectors have been around for decades. They evolved as a solution for easier manufacturing in modern electronics versus legacy terminations such as soldering wires directly to the board. Standard .100” (2.54mm) pitch wire-to-board socket and headers can be found in many industrial and transportation applications for both signaling and power. The PC revolution on the 1980s and 1990s pioneered IDC systems linking hard drives, power suppliers and other I/O devices … [Read more...]
Samtec Releases Twinax Flyover Application Design Guide
The march to faster data rates never seems to stop. Communications protocols used in the data center provide the proof. Fiber Channel signals can run up to 32 Gbps. 25G Ethernet 802.3bj and Ethernet 100G signals can run up to 25Gbps. InfiniBand EDR 104G serial channels support 26 Gbps data rates. This presents engineers of high-speed serial channels with a number of PCB design challenges. Some of the key limitations of PCBs running at 28+ Gbps include trace … [Read more...]
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