If you are at SC14 (SuperComputing) in New Orleans, swing by the Samtec booth (#956) and check out our two demos. One of them demonstrates remote PCI Express® (PCIe®) Gen 3 switching over fiber. The system demonstrated achieves x8 PCIe® Gen 3 data rates (8 GT/s, 64 Gb/s aggregate) to transmit 4k UHD video 100 meters upstream from a PCIe® SSD to a server and back downstream to a GPU linked to a 4k display. The demonstration uses Samtec’s unique PCIEO Series Active Optical cable assembly based … [Read more...]
12G SDI FPGA Mezzanine Card Targeting Xilinx Platforms
Fidus Electronic Development and inrevium has introduced the TB-FMCH-12GSDI, a 6G/12G SDI FPGA Mezzanine Card (FMC) targeting Xilinx platforms. Fidus uses six, 75 ohm Samtec HDBNC connectors, as well as SEARAY™ interconnect systems as specified in the VITA 57 standard. The six HDBNC connectors support: 1x 12G SDI input, 1x 12G SDI output, 3x 12G In or Out, and 1x Video Sync input. With onboard Sync separator and Clock Generator, the FMC can provide all necessary inputs to the FPGA. The FMC is … [Read more...]
0,80 mm Pitch Discrete Wire System Offers High Reliability with Space Savings
Samtec recently expanded its line of Tiger Eye™ products with a 0,80 mm pitch discrete wire system ideal for rugged applications where a highly reliable connection must be maintained. The micro pitch system increases contact density for greater space savings and features Samtec’s Tiger Eye™ contacts, which are designed for high reliability and high mating cycles. The Tiger Eye™ discrete wire socket cable assembly (SESDT Series) is available in a double row design with up to 40 total positions … [Read more...]
New Panel Mount Discrete Wire Cable Assembly
Samtec recently released a new panel mount discrete wire cable assembly as part of its Mini Mate® product family. This new panel mount discrete wire assembly is ideal for in-line connections required to pass through a panel. The assembly accommodates a panel thickness of .0329" (0,84 mm) to .0897” (2,28 mm). This .100" (2,54 mm) pitch Mini Mate® panel mount assembly (MRTD/MRTDT Series) is a double row terminal cable with up to 30 total positions and a choice of 20 to 30 AWG discrete wire in … [Read more...]
Sealed, High Density IP67 Mini Push-Pull System
Samtec's new AccliMate™ Sealed Mini Push-Pull system is IP67 protected against dust and water, making it ideal for harsh environments and high density applications. The system is constructed of lightweight plastic and designed with a small round form factor for increased density on the panel. These are available as the MCP-8 and MCR-8 Series This sealed cable system is intermateable with the Hirose HR30 Series, allowing for ease of integration into existing systems. The cable-to-cable … [Read more...]
High Density SEARAY™ .8 Saves 50% Board Space
Samtec's ultra high density open pin field arrays, created on an 0,80 mm pitch can save you up to 50% board space compared to standard 1,27 mm pitch grid arrays. High density socket arrays, our SEAF8 Series, and terminal arrays, our SEAM8 Series, come standard with patented rugged Edge Rate™ contacts, which are less prone to damage when “zippered” to unmate. SEARAY™ .8 is currently available up to 300 I/Os Two new options include an 8 row and a 10 row design which allow up to 500 I/Os. … [Read more...]
Micro Array Interposers For High Density, Low Profile Board-to-Board and IC-to-Board Applications
Samtec Z-Ray™ is an array of embedded contacts used as interposers for board stacking, IC-to-board, and cable-to-board applications. These micro array interposers are ultra-high density, low profile, highly customizable solutions for complex IC-to-board applications. Z-Ray™ incorporates spring temper BeCu (Beryllium Copper) micro-formed contacts that are assembled into rugged low profile FR4 substrates under high pressure and temperature. Z-Ray™ is tested to 2,500 cycles and is available … [Read more...]
Micro Flyover Cable System Allows Future-Proof Designs
Samtec's FireFly™ Micro Flyover System is an inside-the-box interconnect system that gives designers the option to future-proof their systems. This future proofing allows an easy upgrade from copper to optical with the same connector and footprint. With the highest 14 Gbps bandwidth density available, the FireFly™ system enables chip-to-chip, board-to-board and system-to-system connectivity at data rates up to 28Gb/s (in development). By taking the data connections “off-board” with flyover … [Read more...]
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