A popular demonstration at Super Computing 2019 (SC19) was a collaboration between Samtec and eSilicon that emulates next generation data center architectures for typical 19 inch rack-mount applications. In the video above, Ralph Page, Systems Architect at Samtec, walks us through this chassis-to-chassis demonstration that shows mid-board connectivity via a five meter cable backplane architecture.
Signal Path and Topology
An eSilicon 7nm SerDes generates PRBS-31, 56 Gbps PAM4 signals. The signals are routed from the SerDes to a Samtec AcceleRate® slim body cable assembly,
This is 18” of Samtec Eye Speed low skew 34 AWG twinax cable, which then connects to a Samtec ExaMAX backplane connector on the back panel.
The signal then travels through a five meter long, 30 AWG ExaMAX® backplane cable assembly, to the back panel of chassis #2.
The channel repeats itself on the other side – from the backplane connector on the back panel, through another AcceleRate connector system utilizing 18” of low skew twinax, and back to the eSilicon RX.
This is a common application where the mid-board cable assembly connector is located close to the chip, directing the signal to the back panel.
The bit error rate (BER) is e-9. Overall, this topology has a total loss of about -35 dB, with the backplane cable connector system accounts for approximately -28 dB of the loss. And the eye pattern is wide open.
This demonstration shows that Samtec Flyover systems can be used in mid-board and cable backplane applications to achieve next gen speeds with longer reach instead of routing signals through lossy PCBs, vias, and other components. This technology can also be used to transfer 56 Gbps PAM4 data from rack to rack
Samtec Eye Speed Cable typically runs up to four wire gauge sizes faster than other cables.
Want To Learn More?
If you want to learn more about Samtec Flyover go to samtec.com/flyover.
If you have questions please contact us at SIG@samtec.com
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