OFC 2017, The Optical Networking and Communication Conference & Exhibition, is a global forum and exhibition for optical communications and networking possibilities.
Samtec will showcase the latest FireFly™ Optical Cable Systems, including new PCIe® Over Fiber, extended temperature, and low-profile designs. We will also discuss how the Samtec FireFly™ connector was adopted by the Consortium for On Board Optics, and we will run four product demonstrations, among others.
OFC 2017 Products, Announcements, and Demos
PCIe® Over Fiber: This product demonstration will showcase a disaggregated computing platform with PCIe® Gen 3 fabric enabled by the patented FireFly™ mid-board technology.
By using PCIe®-over-Fiber, storage and GPU can be located 100 meters away, demonstrating the opportunity for new HPC/Data Center architectures that benefit from the high-performance, low latency that the PCIe® protocol enables.
Virtex® UltraScale+™ FPGA VCU118 Evaluation Kit Demo: In this demo, four GT 28 Gbps transceiver signals are generated by an FPGA and launched mid-board from a FireFly™ 28 G x4 optical connector system. These 28 Gbps signals then “flyover” the board through a FQSFP twinax cable assembly, to the port, and loop back over the same path, where they are received by the FPGA. The demonstration confirms 28 Gbps performance on all four links, with zero bit errors.
Optical FMC Demo: Samtec will demonstrate their new VITA 57.1 FMC interoperating with the TechwaY TIGER FMC. This demonstration will have ten Xilinx GTH transceivers operating over 100 meters of fiber. These FMC offer an easy way to provide optical I/O to standard FPGA enabling much longer links without losing any of the speed and flexibility benefits that the FPGA provide.
Consortium For On Board Optics: Samtec will present additional details about their COBO contributions during OFC 2017 at the Los Angeles Convention Center in Los Angeles, CA. Mr. Jignesh Shah will participate in the panel “On-Board Optics – Challenges, Discoveries and the Path Forward” Wednesday, March 22 from 10:15 – 11:45 PST in Expo Theater II. The panel will review the technical challenges facing on-board optical modules and discuss developing trends in data center networking.
Microelectronics: Samtec’s microelectronics capabilities will also be on display. Samtec provides complex package assembly, including precision die attach and ultra-fine pitch wirebond, for a variety of traditional and glass substrates, with expertise in packaging and substrate design, stacked die and multi-chip modules. We can also discuss Glass Core Technology, a proprietary through-glass via that enables next generation solutions for high-performance products.
If you’re at OFC, visit us at booth #2139.
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