The gang’s all here!
We’ve recently pulled together Samtec’s family of AcceleRate® products into one webpage so you can easily browse and compare to find the best high-performance solution for your next gen application. The board-to-board and cable assemblies feature extreme density with up to 1,000 total I/Os on a 0.635 mm pitch and extreme 112 Gbps PAM4 performance.
So, let’s get this party started with (re)introductions all around…
First up is AcceleRate® HD high-density arrays with up to 400 Edge Rate® contacts in a slim, low profile design. AcceleRate® HD features a 5 mm body width for incredible space savings and stack heights from 5 mm to 16 mm. The open-pin-field design allows for maximum grounding and routing flexibility to fit your application. AcceleRate® HD supports 56 Gbps PAM4 applications and is PCIe® 5.0 capable.
Next is AcceleRate® HP high-performance arrays to 112 Gbps PAM4 and data rate compatible with PCIe® 5.0 as well as 100 GbE. The 4-row design allows up to 400 total I/Os with 1,000+ on the roadmap. AcceleRate® HP is a cost optimized solution with an open-pin-field design and stack heights from 5 mm to 10 mm for incredible flexibility. COM-HPC® adopted Samtec’s AcceleRate® HP 400 pin connectors to support existing and future interfaces such as PCIe® 5.0 and up to 100 GbE.
Now introducing the cable assemblies.
Samtec’s AcceleRate® direct attach cable assembly is the industry’s slimmest system, 7.6 mm wide, with ultra low skew twinax cable for 56 Gbps PAM4 speeds. Eight, 16 and 24 differential pair options are available in a high-density two row design. Contacts directly attached to the cable eliminates the need and variability of a transition card and improves signal integrity. AcceleRate® utilizes Flyover® technology to route data above lossy PCB, thus simplifying board layout and extending signal reach. Metal latching, shielding and weld tabs make the system ideal for rugged applications.
Last but not least, AcceleRate® HP is the industry’s highest density 112 Gbps PAM4 rated solution for cable-to-board applications. Available in 32 to 72 differential pairs on a 0.635 mm contact pitch, with a staggered row-to-row pitch of 2.2 mm x 2.4 mm allowing adequate routing lanes for optimized differential pair traces. This system also features direct attach technology for impedance control and lower losses through Eye Speed® ultra low skew twinax cable. As a direct-to-chip package solution, AcceleRate® HP cable system is ideal for AI, HPC and data center applications.
If that wasn’t enough, here’s a little something to take home with you. Expect Samtec’s AcceleRate® family to continue growing with more options and a new cable system.
If you’d like to keep the party going beyond the new AcceleRate® webpage, check out these other posts: