Summer. Time for a break!
Whether “taking a vacation” or “on holiday”, individuals and families are gearing up for the peak July/August travel season. Many will go to the beach. Others will take long road trips. Others prefer an escape to nature in the mountains or on a lake.
Regardless of destination, vacation or holiday planning means data consumption. Booking plane tickets. Making hotel reservations. Researching a new activity. All done online. Of course, peak travel time will not crash the internet. However, it does illustrate the insatiable need for more data.
Data rates are increasing across the high-speed communications network. Data centers require bleeding edge performance as the backbone of the network. The global 5G rollout and growing cloud connectivity also contribute to growing data needs.
As a global provider of high-performance interconnects, Samtec offers a comprehensive portfolio of 112 Gbps PAM4 solutions. Getting electrons (or photons) from Point A to Point B can take many paths. What options are available?
NovaRay® Extreme Density Arrays
NovaRay® combines extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays. The innovative design of NovaRay offers multiple points of contact to ensure a more reliable connection. The fully shielded differential pair design contributes to the industry leading 4.0 Tbps aggregate data rate.
Key features include:
- 112 Gbps PAM4 per channel
- 4.0 Tbps aggregate data rate – 9 IEEE 400G channels
- Innovative, fully shielded differential pair design enables:
- Extremely low crosstalk (to 40 GHz)
- Tight impedance control
- Minimal variance in data rate as stack height increases
- 112 differential pairs per square inch
- Utilizes 40% less space than traditional arrays with the same data throughput
- BGA attach to board for greater density and optimized trace breakout region
For more information, please visit www.samtec.com/novaray.
Si-Fly™ Low-Profile High-Density Cable System
Si-Fly uses direct connect technology to elude the BGA and route signals directly from the silicon package through a long-reach cable. The high density design and on-package technology enable speeds of 25.6 TB aggregate, with a path to 51.2 TB. This flexible system architecture offers 5x the reach of traditional PCB topologies.
Key features include:
• Ultra-high density with direct connect or adjacent to IC package technology
• Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
• Extreme channel performance enabling 25.6 TB aggregate with a path to 51.2 TB
• Samtec offers two Direct Connect to IC package solutions: FireFly™ (available now) & Si-Fly (in development)
For more information, please visit www.samtec.com/si-fly.
AcceleRate® HP High-Performance Arrays
AcceleRate HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design. AcceleRate HP also served as the basis for the new COM-HPC®Interconnect Solutions from Samtec.
Key features include:
- 0.635 mm pitch open-pin-field array
- 56 Gbps NRZ/112 Gbps PAM4 performance
- Cost optimized solution
- Low-profile 5 mm and up to 10 mm stack heights
- Up to 400 total pins available; roadmap to 1,000+ pins
- Data rate compatible with PCIe® Gen 5 and 100 GbE
For more information, please visit www.samtec.com/accelerateHP.
Of course, this does not represent every 112 Gbps PAM4 solution Samtec offers. Please reach out to your local Samtec representative or e-mail SIG@samtec.com for more details.
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