Our friends at Signal Integrity Journal recently reported Samtec’s and Molex’s collaboration on high speed, next-generation data centers. The complete article is worth the read, but here’s the Cliff’s Notes version:
SIJ referred to the Licensed Source Agreement for the Samtec Twinax Flyover™ and Molex BiPass™ systems fo high-speed data (56 Gbps and 112 Gbps) speeds.
According to a Molex spokesperson, both product lines approach their customers’ design challenges in the same fundamental way — by significantly lowering losses from the ASIC to the front or back panel I/O or backplane ports. Where they differ is in cable construction, internal connector construction, and board-mount connectors near the ASIC. In essence, the products serve the same function, they just approach it a bit differently. Samtec’s VP of Engineering, Brian Vicich, notes that the Molex and Samtec QSFP28 and QSFP-DD products are already port-compatible, and both companies are “evaluating all options at the moment of supporting dual footprints.”
AS SIJ reports, Samtec and Molex have both made significant achievements in these “above the board” interconnect designs. As with all leading-edge designs, there was bound to be challenges and limiting factors.
For Samtec, the challenge was to develop full-channel connectivity solutions instead of just a node in the system. Vicich says, “This approach requires a dedicated signal integrity team, world-class high-speed cable development, and highly advanced interconnect contact designs.” He notes the importance of advanced simulation in advance of tooling the product, and performance validation after it is made. The article later notes that “Samtec has demonstrated 112 Gbps PAM4 data rates across its Twinax Flyover solutions.”
Here’s the link to the entire article if you want all of the details. Personally, I’m a frequent visitor to SIJ because it’s a good source of news , products, and technologies relating to all things Signal Integrity.
Other links that may be of interest: