DesignCon 2017 moves into its second day at the Santa Clara Convention Center. With all of the industry’s heavy-hitters here, attendees are focused on what’s next.
There are numerous demonstrations, presentations and trainings focused on 56/112 Gbps applications. While there are numerous opinions about how things will play out, some overall technology trends continue to emerge.
Achieving 56/112 Gbps performance is not trivial regardless of application or modulation scheme. Applications run the gamut: chip-to-chip, chip-to-module, backplane and others.
Whatever the case, the technology challenges remain constant. Noise sources can be found in complex IC packages, vias of all kind, limited PCB materials, long channel traces, noisy connectors, and the list goes on.
Typical noise sources are addressed via several standard approaches. Noisy PCB materials like FR4 can be replaced with improved PCB materials. Long length channels can be shortened with better layout and component selection.
However, traditional approaches have finite effects as 56/112 Gbps applications. Other approaches and architectures are needed.
Samtec Flyover™ Systems
One new approach being championed by many is using low-noise twinax cable as a replacement for long reach PCB traces in high performance systems. In short, low noise, low skew cables offer SI performance enhancements at high speeds and long distances over the most advanced PCB materials.
Samtec’s “Flyover” design approach breaks the constraints of traditional signaling substrate and hardware offerings, resulting in a cost-effective, high-performance answer to the challenges of 28 Gbps bandwidths and beyond.
Samtec’s high-performance, low-loss twinax cable systems support 28 Gbps and beyond while providing for extended signal reach and system architecture design flexibility – without adding cost to the overall system.
Samtec ExaMAX® Backplane Connector System
In addition to twinax in multiple applications, different backplane architectures are being explored by the industry. A popular option for many is orthogonal backplane architectures. This approach essentially removes the traditional backplane or midplane to simplify system chassis design.
In addition to increasing line card density and offering improved system airflow, orthogonal and direct-mate orthogonal backplanes help shorten system trace lengths. When combined with twixax cable, this offers a compelling solution for next generation systems.
Samtec’s ExaMAX® high-speed backplane connector system (EBTM/EBTF-RA Series) enables 28 Gbps performance on a 2.00 mm column pitch with a roadmap to 56 Gbps.
This rugged system has the industry’s lowest mating force with excellent normal force, a 2.4 mm contact wipe and two points of contact for high reliability.
Among other specifications, ExaMAX® exceeds OIF CEI-28G-LR for 28 Gbps standards and meets the Telcordia GR-1217 CORE specification. The ExaMAX® roadmap includes cable, DMO, mid-plane orthogonal and coplanar orientations.
Please stop by the Samtec Booth (#717) at DesignCon to learn more about these new and exciting solutions for next-gen high-speed systems.
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