Our friends at EDN recently published Solving Signal Integrity Problems At Very High Data Rates. The article – written by Lee Ritchey and Kella Knack from Speeding Edge and Teraspeed’s own Scott McMorrow – discusses the challenges of achieving high data rates given parasitics in PCBs. It presents a novel, alternative design approach to the problem. To elaborate a…
A number of embedded applications leverage the brute-force serial processing of x86 CPUs. Higher speed CPUs lead to higher performance embedded computers. This model works in general computing applications, but parallel computing solutions offer another option for high efficiency and performance. Graphics Processing Units (GPUs) differ from CPUs in basic architecture. GPUs contains a larger…
“Cable assemblies!” What usually enters someone’s head when they hear that phrase? Ethernet patch cable assemblies? Standard video cables assemblies like HDMI, DVI, miniDP or even VGA that link a laptop or tablet to an LCD Projector or wall-mount TV? Probably. In the world of high-speed cable assemblies, Samtec has found a unique nitch for…
The adoption of UHDTV technologies continues to be widespread. Consumers can purchase Smart 4K UltraHD LED TVs – some event curved – in ever larger sizes. UltraHD Blu-ray discs and players are now widespread. 4K UltraHD cameras are being used for video conferencing. The list goes on. The engineering community behind these great consumer products needs the appropriate…
As a global leader in signal integrity, Samtec’s in-house engineering team utilizes EDA tools across the industry via our global 24/7 support of customer SI designs and applications. Our experience with these tools enables unique collaborations with EDA suppliers and industry leading technical events. At the recent Mentor Graphics PCB Forums, signal integrity experts from Teraspeed® Consulting, a…
Steve Groothuis, CTO of Samtec Microlectronics, recently conducted a workshop at the Autonomous Vehicles 2016 Conference and Workshop. Steve’s presentation is “Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules.” This is second installment in a two-part article with a video of the conclusion of Steve’s workshop presentation. Here is the link to the first blog, with…
The auto industry is poised for more change in the next five to ten years than it’s seen in the past 50. That quote, from Mary Barra, CEO of General Motors, illustrates the driving force (no pun intended) for increasingly complex electronics in vehicles. Steve Groothuis, CTO of Samtec Microlectronics, recently conducted a workshop at…
The term “interchangeable parts” became popular towards the mid to late 19th century. As the Industrial Revolution began in the United States, a man named Eli Whitney demonstrated this concept by disassembling and reassembling a pile of the exact same firearms in front of Congress. The idea rapidly caught on leading to weapons, farming equipment,…
Samtec continues to expand its capabilities in support of backplane connector applications. In addition to our recent announcement with Amphenol, we continue to augment the ecosystem of support required for these high-speed, high-performance products. When we announced the initial release of Channelyzer™ – Samtec’s Online Full Channel Simulation and Analysis tool – earlier this year, the tool initially supported…
Samtec has a long history of developing mezzanine interconnect solutions that meet and exceed our customer’s expectations. Our legacy revolves around standard board-to-board connectors used in applications ranging from TV remotes to MRI machines. Our depth of solutions has grown as time has passed, but one family of products offers the density, performance and flexibility…
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