Samtec Razor Beam™ products are micro pitch, high density, high speed interconnect systems. Razor Beam products save space on the X, Y, and Z axes. In other words they are very fine pitch, they have slim body designs, and they are low profile. RAZOR BEAM While Samtec Razor Beam interconnects are micro pitch – on…
Designers periodically ask us for a “general bandwidth performance rating” to compare two or more interconnect systems. Of course numerous variables affect the signal integrity performance of an interconnect, so a one-size-fits-all approximation definitely does not fit all. Now, a new approach allows system signal integrity engineers to compare relative performance of connectors and cable assemblies…
Samtec proudly announces the release of a high-speed board-to-board connector family compliant to the ANSI/VITA 57.4-2016 standard. Samtec’s family of FMC+ connectors helps support the expanded interface and faster speeds of the latest FMC+ applications. The new ANSI/VITA 57.4-2016 standard extends the capabilities of ANSI/VITA 57.1-2010 in support of the increased number and data rates…
Samtec’s FireFly™ Micro Flyover System™ continues to gain industry acceptance in mid-board copper and optical cable assembly systems. The ECUO series can be found in a number of applications requiring standard temperature ranges. The popularity of ECUO has established a need for an extended temperature version of the FireFly™ Active Optical Cable Assemblies. In response, Samtec recently released the…
PCIe 4.0 is just around the corner in 2017, at least according to the leading computer processor vendors. In recent months, both Intel and AMD have hinted at plans for PCIe 4.0 in future platforms. This promotes the advantages of the new standard with hopes of a wider range of applications. Here is a quick review…
Samtec is pleased to announce a new ChalkTalk entitled “SI? Why do I Care?.” Hosted by EEJournal, this newly released ChalkTalk details SI basics and how they affect connector selection. SI not just for “Experts” Most designs these days have high-speed interfaces that require a solid strategy for SI. This calls for understanding the “basics”…
Eric Bogatin, Signal Integrity guru and friend of Samtec, recently posted a blog on “Best Practices For Connector Models.” He posted this on his Signal Integrity Journal website. Eric spoke with two of the worlds’ experts on high frequency electrical characterization of interconnects: Samtec’s own Jim Nadolny, our Principle SI Engineer, and Heidi Barnes, the…
IMAPS – International Microelectronics Assembly and Packaging Society – in one of the biggest events of the year in the IC Package and Assembly industry. Last week at IMAPS 2016, Samtec Microelectronics highlighted our world-class complex package and assembly capabilities and our emerging Glass Core Technology (GCT). Samtec’s IC package and assembly capabilities include precision die attach, ultra-fine…
Samtec proudly announces the expansion of the ExaMAX® High-Speed Backplane Connector System optimized for high-density and high-speed performance. The scalable ExaMAX® system meets today’s data rates while providing a future-proof path for next generation architectures. The ExaMAX® header and right-angle receptacle system (EBTM/EBTF-RA Series) is optimized for speeds up to 28 Gbps on a 2.00…
Samtec is pleased to announce a new ChalkTalk entitled “Expanding the Backplane Ecosystem.” Hosted by EEJournal, this newly released ChalkTalk details the growing backplane connector portfolio from Samtec. Samtec entered the backplane connector market by licensing FCI’s ExaMAX® High-Speed Backplane Connector System. Over the past few years, Samtec has developed numerous soon-to-be-released backplane connector mated pairs. Samtec…
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