Samtec – A Custom Cable Assembly Solution Provider?
“Cable assemblies!”
What usually enters someone’s head when they hear that phrase? Ethernet patch cable assemblies? Standard video cables assemblies like HDMI, DVI, miniDP or even VGA that link a laptop or tablet to an LCD Projector or wall-mount TV? Probably.
In the world of high-speed cable assemblies, Samtec has found a unique nitch for itself. While most Samtec competitors focus on industry-standard or high-volume application-specific cable assemblies, Samtec focuses on customized high-speed cable assemblies.
Samtec combines its vertically integrated cable manufacturing plant with our Advanced Interconnect Design capabilities built to customer specifications.
Samtec’s in-house cable and custom cable assembly capabilities include:
- Micro-coax and twinax design, development and volume manufacturing
- Advanced R+D and signal integrity expertise
- Interconnect design, development and volume manufacturing
- Vertically integrated, quick-turn product and volume manufacturing
This vertical integration allows for the ultimate combination of design flexibility and customer service.
Advantages of Samtec’s model include:
- Shorter, controlled lead times
- Highest quality product
- Optimized performance
- In-house impedance controlled PCB design and processing
- Unparalleled pricing and delivery
Samtec’s Wilsonville, OR cable facility focuses on R&D and manufacturing of precision extruded micro coax and twinax cable used for high-speed, high-density cable assemblies, including 26-38 AWG, 50/75/85/100 Ω impedance, and systems rated at 28 Gbps and beyond.
One focus area of Samtec’s R+D is solid center conductor co-extruded twinax cables. Solid center conductor cores offer better dielectric properties when compared to stranded center conductors. This leads to enhanced performance such as ultra-low skew and higher data rates.
Other advantages include:
- Provides optimal diameter control capability for tighter tolerances and consistency
- Eliminates stranding variations, providing more consistent dielectric uniformity to conductor for ULS performance
- Significantly lower cost (up to 60% lower)
- Improves preparation and termination quality during assembly
- Allows new termination techniques during assembly for superior interconnect
- Resistance
- Laser bonding
