1. SEAM, SEAF, our popular SEARAY™ line. SEARAY is a high density, high speed, 1.27 mm grid array system. It’s popular because the open pin field gives designers tons of pcb routing and grounding flexibility.
2. FTSH, CLP. These are basic 1.27 mm pitch socket and terminal strips. They are a popular connector system because of the variety of options in the product line, including through-hole and SMT terminations, vertical and right angle designs, and a variety of plating options, among others.
3. High-Speed Cable assemblies. This isn’t a specific product series, but it’s our ability to design and manufacture an almost limitless line of high-speed cable assemblies, with a wide (and I mean WIDE) variety of connectors, high-speed cables, and termination options.
4. TSM, SSM. These are basic 2.54 mm SMT terminal and socket strips. They are popular because they come in all shapes, sizes, and with all kinds of options.
5. TFM, SFM. Our popular Tiger Eye™ contact system that is ideal for rugged, high-cycle, micro pitch applications. This is one of the first connector sets designed for SMT applications; it’s a quality product.
6. TMM, TW, and CLT. They are basic 2.00 mm through-hole terminal and socket strips. Stop me if you’ve heard this before, but this product line oozes design flexibility. You can design just about any stack height, number of positions, orientation, plating, or configuration imaginable.
7. ECUO, FireFly™ optical cable system. The industry-leading miniature footprint allows for greater density and closer proximity to the IC, which simplifies board layout and enhances signal integrity.
8. QTH, QSH. These are Q Strip® products, high-speed mezzanine connectors in stack heights from 5 mm and up (5 mm is the most popular), with an integral ground plane for high speed and/or power applications.
9. ERM8 and ERF8. The 8 stands for 0.80 mm pitch, and the ER stands for Edge Rate® interconnects, which are high-speed, rugged mezzanine connectors.
10. TSW, SSW. These are 2.54 mm equivalents of TMM and CLT above (number 6).
If you can’t stop at 10, the next most popular connector products include HSEC8 (0.80 mm high speed edge card connector), FFSD (1.27 mm pitch IDC cable assembly), LSHM (0.50 mm pitch rugged, ultra-micro Razor Beam™ connector), and GCT, or glass core technology. Glass substrates offer high structural integrity, resistance to vibration and temperature, environmental ruggedness, and low electrical loss, making them ideal for next generation microelectronics demands.