One of the biggest events in the FPGA/SoC ecosystem is the annual Xilinx Developers Forum (XDF). XDF connects software developers and system designers to the deep expertise of Xilinx engineers, partners, and industry leaders.
XDF takes place in three locations this year. Samtec will be attending all three locations as shown below:
- XDF Silicon Valley – October 1-2, 2018
- XDF Beijing – October 16, 2018
- XDF Frankfurt – December 10, 2018
Samtec High-Performance Interconnect
Samtec offers a comprehensive portfolio of high-performance interconnect complementing Xilinx silicon devices. Solutions include:
- VITA 57.1 FMC and VITA 57.4 FMC+ connectors and cable assemblies
- Bulls Eye® Test Point System
- Twinax Flyover™
- ExaMAX® High-Speed Backplane System
Demos of these and other Samtec’s High-Performance Interconnect solutions will be available in the Samtec booth at all XDF locations.
Samtec Products Supporting Xilinx ZCU111 Evaluation Kit
The new Xilinx® Zynq UltraScale+ RFSoC ZCU111 Evaluation Kit enables designers to jumpstart RF-Class analog designs for wireless, cable access, early-warning (EW) / radar and other high-performance RF applications.
Samtec and Xilinx have a long history of collaborative innovation, The new ZCU111 kit furthers this tradition. The new kit features several Samtec expansion connectors and standoffs.
FMC+ Connectors: Based on Samtec’s SEARAYTM High-Speed Array system, FMC+ connectors are 560 I/O high-speed array connectors for FMC+ carriers and daughter cards.
RFMC Connectors: Based on Samtec’s LP ArrayTM Low Profile, High-Speed Array system, RFMC connectors are 320 I/O high-speed array connectors for RFMC carriers and daughter cards.
Jack Screw Standoffs: Samtec JSO Series Jack Screw Precision Board Stacking Standoffs assist with mating and unmating the RFMC connectors, RFMC carriers and daughter cards on the ZCU111.
For more information on Samtec’s solutions on the ZCU111, please click here.
Samtec’s 28 Gbps FireFlyTM FMC+ Development Kit
Samtec’s 28 Gbps FireFlyTM FMC+ Development Kit provides up to 448 Gbps full-duplex bandwidth over up to 16 channels from an FPGA/SoC to an industry-standard multi-mode fiber optic cable. Kits demonstrations will be available at XDF
The new kit supports protocols including Ethernet, InfiniBandTM, Fibre Channel and Aurora typically found in Video, Mil/Aero, Embedded Computing, Instrumentation, HPC and Data Center applications.
As a VITA 57.4 FMC+ solution, the Samtec 28 Gbps FireFlyTM FMC+ Module can be used for optical data communication on any FPGA development board supporting high-speed multi-gigabit transceivers.
It can run system data or BERT testing on all channels in parallel. This makes evaluation and development with an FPGA much easier.
