- XDF Silicon Valley – October 1-2, 2018
- XDF Beijing – October 16, 2018
- XDF Frankfurt – December 10, 2018
Samtec High-Performance InterconnectSamtec offers a comprehensive portfolio of high-performance interconnect complementing Xilinx silicon devices. Solutions include:
- VITA 57.1 FMC and VITA 57.4 FMC+ connectors and cable assemblies
- Bulls Eye® Test Point System
- Twinax Flyover™
- ExaMAX® High-Speed Backplane System
Samtec Products Supporting Xilinx ZCU111 Evaluation KitThe new Xilinx® Zynq UltraScale+ RFSoC ZCU111 Evaluation Kit enables designers to jumpstart RF-Class analog designs for wireless, cable access, early-warning (EW) / radar and other high-performance RF applications.
Samtec and Xilinx have a long history of collaborative innovation, The new ZCU111 kit furthers this tradition. The new kit features several Samtec expansion connectors and standoffs.
FMC+ Connectors: Based on Samtec’s SEARAYTM High-Speed Array system, FMC+ connectors are 560 I/O high-speed array connectors for FMC+ carriers and daughter cards.
RFMC Connectors: Based on Samtec’s LP ArrayTM Low Profile, High-Speed Array system, RFMC connectors are 320 I/O high-speed array connectors for RFMC carriers and daughter cards.
Jack Screw Standoffs: Samtec JSO Series Jack Screw Precision Board Stacking Standoffs assist with mating and unmating the RFMC connectors, RFMC carriers and daughter cards on the ZCU111.
For more information on Samtec’s solutions on the ZCU111, please click here.