Low latency. This simple two-word phrase drives entire industries solely focused on minimizing propagation, serialization, queuing, and processing delays in packet-switched networks. This is especially in HPC applications where high-throughput and low-latency are mandatory.
Many approaches can be taken to minimize network latency. Optimized operating systems, next-gen network fabrics and FPGA co-processing are among a number of techniques used to drive low latency in HPC applications. Proprietary network interconnect topologies and technologies provide another alternative for driving ultra-low HPC latencies.
EXTOLL Tourmalet – The HPC Network ASIC
Mannheim, Germany-based EXTOLL provides an innovative communication solution enabling ultra-low latencies while avoiding expensive, power-hunger network switches. EXTOLL’s solutions replace legacy interconnect topologies within the HPC application while simultaneously supporting multi-core processing, virtually unlimited scalability, and tight coupling between computational units.
![hpc](https://blog.samtec.com/wp-content/uploads/2017/12/tourmalet-e1512157535292-1024x576.jpg)
The Tourmalet platform leverages previous EXTOLL technology in an ASIC form factor. Tourmalet integrates all communications functions at unrivaled message rates in a cost-effective, scalable interconnect topology for next-gen, ultra-low latency, high bandwidth HPC applications.
Samtec Eye Speed® HD Interconnect Solutions
Tourmalet utilizes proprietary communication protocols at the I/O port physical layer. This feature enabled EXTOLL to choose protocol-independent physical interconnect technology lining numerous Tourmalet platforms together. Samtec’s Eye Speed® HD Interconnect Solutions proved the ideal selection for its combination of superior performance and space saving design.
The signal integrity performance of the Eye Speed® HD Interconnect Solutions helps EXTOLL produce reliable and bit-error free HW channels on the Tourmalet platform. This helps reduce or eliminate the need for FEC in real-time HPC applications.
The combination of the HDC series Eye Speed® HD Cage and HDI6 series 0.635 mm Eye Speed® HD High-Speed High-Density Receptacle provides an ideal solution for populating high-density panels. The low-profile, stacked receptacles nest tightly together and offer enhanced configurability and integration.
The HDLSP series 0.635 mm Eye Speed® HD High-Speed High-Density I/O Cable Assemblies are used to link two (or more) Tourmalet platforms together as shown below. The HDLSP cables offer 48 signal pairs in a compact panel opening that fits the full height of a PCIe card. Standard cable lengths are 1 m and 2 m.
![](https://blog.samtec.com/wp-content/uploads/2017/12/extoll_demo-1024x576.jpg)
For more information on Samtec’sEye Speed® HD interconnect solutions, please download the Twinax Flyover Application Design Guide or the High Speed Cable Design Guide or e-mail Samtec’s HDR technical experts at [email protected].