Low latency. This simple two-word phrase drives entire industries solely focused on minimizing propagation, serialization, queuing, and processing delays in packet-switched networks. This is especially in HPC applications where high-throughput and low-latency are mandatory.
Many approaches can be taken to minimize network latency. Optimized operating systems, next-gen network fabrics and FPGA co-processing are among a number of techniques used to drive low latency in HPC applications. Proprietary network interconnect topologies and technologies provide another alternative for driving ultra-low HPC latencies.
EXTOLL Tourmalet – The HPC Network ASIC
Mannheim, Germany-based EXTOLL provides an innovative communication solution enabling ultra-low latencies while avoiding expensive, power-hunger network switches. EXTOLL’s solutions replace legacy interconnect topologies within the HPC application while simultaneously supporting multi-core processing, virtually unlimited scalability, and tight coupling between computational units.
The Tourmalet platform leverages previous EXTOLL technology in an ASIC form factor. Tourmalet integrates all communications functions at unrivaled message rates in a cost-effective, scalable interconnect topology for next-gen, ultra-low latency, high bandwidth HPC applications.
Samtec Eye Speed® HD Interconnect Solutions
Tourmalet utilizes proprietary communication protocols at the I/O port physical layer. This feature enabled EXTOLL to choose protocol-independent physical interconnect technology lining numerous Tourmalet platforms together. Samtec’s Eye Speed® HD Interconnect Solutions proved the ideal selection for its combination of superior performance and space saving design.
The signal integrity performance of the Eye Speed® HD Interconnect Solutions helps EXTOLL produce reliable and bit-error free HW channels on the Tourmalet platform. This helps reduce or eliminate the need for FEC in real-time HPC applications.
The combination of the HDC series Eye Speed® HD Cage and HDI6 series 0.635 mm Eye Speed® HD High-Speed High-Density Receptacle provides an ideal solution for populating high-density panels. The low-profile, stacked receptacles nest tightly together and offer enhanced configurability and integration.
The HDLSP series 0.635 mm Eye Speed® HD High-Speed High-Density I/O Cable Assemblies are used to link two (or more) Tourmalet platforms together as shown below. The HDLSP cables offer 48 signal pairs in a compact panel opening that fits the full height of a PCIe card. Standard cable lengths are 1 m and 2 m.
For more information on Samtec’sEye Speed® HD interconnect solutions, please download the Twinax Flyover Application Design Guide or the High Speed Cable Design Guide or e-mail Samtec’s HDR technical experts at HDR@samtec.com.
