AI chip solutions are getting faster. GPUs, the workhorse of many applications, seem to increase in performance while also reducing power. Other AI chip solutions like IPUs, TPUs and traditional FPGAs and SoCs feature 112 Gbps PAM4 transceivers.
Getting data from point A to point B as fast as possible always seems to be a challenge. Fortunately, at the upcoming AI Hardware Summit 2022, co-located with the AI Edge Summit, technical experts from Samtec will focus on a number of 112 Gbps PAM4 solutions for AI/ML applications
Flexible 112 Gbps PAM4 System Architectures
Routing electrons or signal paths from chip-to-chip, board-to-board or rack-to-rack within AI hardware system architectures requires design flexibility. Fortunately, Samtec offers a comprehensive portfolio of 112 Gbps PAM4 front-panel, mid-board and backplane interconnects ideal for AI/ML applications.
AcceleRate® HP: AcceleRate HP high-performance arrays and cable systems, on 0.635 mm pitch, feature open-pin-field design maximizing grounding and routing flexibility. Data Rate compatible with PCIe®5.0 and 100 GbE. Low-profile 5mm and up to 10 mm stack heights.
ExaMAX® Backplane Cable System: ExaMAX® backplane cable systems leverage Samtec Flyover® technology for improved bandwidth and reach in backplane applications. Direct solder attach to contacts optimizes the signal path, further enhancing performance.
Flyover® QSFP Cable System: Samtec’s Flyover QSFP Systems (FQSFP-D8 for 800 Gbps ports) provide improved signal integrity and architectural flexibility by routing critical high-speed signals through low-loss, ultra low skew twinax cable, instead of through expensive, lossy PCBs.
NovaRay®: NovaRay arrays and cable systems combine extreme density and performance in a small form-factor. The fully shielded differential pair design and two reliable points of contact contribute to the industry-leading 4.0 Tbps aggregate data rate.
NovaRay I/O Front Panel Cable System: NovaRay I/O offers the highest aggregate data rate on the market, 3,584 Gbps PAM4, with a high-density cable-to-cable bulkhead panel connection. Passive electric external cables prevent a large thermal load at the panel with heat sinks, saving valuable panel space.
Emulated Real World AI System Architectures
In past AI HW Summits, Samtec, and several silicon partners have demonstrated a prototypical PECFF Emulation Platform. It shows PCB connectors and twinax cable systems, with performance capabilities eminently suitable for AI hardware applications.
The PECFF Emulation Platform offers a configurable, scalable system featuring SNIA SFF-TA-1002 interconnect for add-in-card (AIC) connectivity. Top card connectivity provides additional data paths for high-speed signals.
In past years, this system has supported PCIe 5.0 (32 GT/s) or PCIe 6.0 (64 GT/s PAM4) performance. This year, Samtec and a special partner will demonstrate 112 Gbps PAM4 data rates on some new enhancements to this rugged, tried-and-true platform. Stop by the Samtec booth during the AI HW Summit for more details.
Register to Attend
Samtec is proud to be an Event Partner at AI Hardware Summit. Register here to attend.
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