Embedded engineers – hardware, software and firmware – are constantly challenged to get products to market quickly. Consequently, electronics components manufacturers and their partners are easing this process. Innumerable references designs, evaluation boards and development kits accomplish this goal.
Two new solutions available from Neutron Controls and Crossfield Technology are targeted at specific applications. Similarly, they both feature unique, high-performance interconnect solutions from Samtec.
Neutron Control REDLINE™
Ottawa-based Neutron Controls engineers development boards for the electronic control of vehicles. Their REDLINE (Rapid Engineering Development System) solution is a modular development platform designed by engineers for engineers. A modular approach to MCU development shortens the design cycle.
The REDLINE system targets automotive applications like Autonomous Vehicles, ADAS, electric vehicles, battery management, drive train, and motor control. At a minimum, the system includes a Carrier Board, an MCU Module, a Power Module and an Interface Module.
Neutron has designed REDLINE with flexibility and customization in mind. REDLINE is easily configured to meet application-specific requirements. For example, the hardware, firmware and interconnect are interoperable in any number of configurations.
The Carrier Board connects to one of two MCU Modules via a pair of Samtec Z-Ray® ultra-low profile, high-density one-piece arrays.
A pair of 20×10 Z-Ray arrays offers high-performance and high-density in a small footprint. Additionally, compression contacts and alignment pins make a secure interconnect.
The MCU Module can be used in customer target platforms as well. This enables a prototype-to-production system that leverage the flexibility and ease-of-of use of Z-Ray in OEM-design carrier cards.
Another interconnect is made between the Carrier Board and various Interface Modules. Samtec’s FTSH series .050″ Micro Terminal Strips make for a rugged interconnect. Additionally, FFTP series .050″ Tiger Eye™ IDC Twisted Pair Cable Assemblies may interconnect to FTSH series. FTSH and FFTP series are also ELP.
While REDLINE features various Samtec interconnect, there is one other important interconnect. The Carrier Board connects to an External Bus and High-Speed Serial Link using Samtec’s 0.80 mm Edge Rate® interconnect solutions. These include the ERM8 series, ERF8 series and ERCD series products.
Finally, the Samtec Automotive Interconnect Solutions Guide provides a comprehensive overview Samtec’s capabilities. Please contact our technical experts at AutoSalesGroup@samtec.com.
Crossfield Technology 6U VPX NVMe SSD
Austin-based Crossfield Technology applies emerging processing, networking and storage technologies to create innovative devices across a number of applications. Crossfield’s highly skilled and experienced scientists and engineers rapidly develop solutions to complex problems using next-generation technology.
The Crossfield 6U VPX NVMe SSD contains up to eight industry-standard SSD slots. Each SSD slot communicates with an onboard PCIe switch that connects the SSD slot to a front panel of a VPX backplane connector. The flexible VPX module supports up to 16 TB of total system storage.
The 6U VPX NVMe SSD also features optional Samtec’s FireFly™ Optical Engines. These provide optical connectivity to the front panel or backplane connector. A single FireFly supports x8 PCIe Gen 3 while dual FireFly supports x16 PCI Gen 3.
For more information, please visit www.samtec.com/firefly or e-mail Samtec’s technical experts at FireFly@samtec.com.
