This live demonstration from NAB 2019 compares return loss performance of Samtec 12G SDI RF connectors per SMPTE ST-2082-1 12G-SDI requirements.
In this video, Chris Shelly, Samtec’s RF/SI Modeling Engineer, compares the performance of Samtec’s industry standard edge mount BNC connectors to a 75 Ω right-angle BNC, an HDBNC and a DIN 1.0/2.3, and he shows how optimized launches improve performance.
The standard edge mount BNC connector has excellent performance of approximately -20 dB return loss or better through 12 GHz. Next, Chris compares the edge mount BNC to the BNC7T-BM1D, Samtec’s new low profile, right-angle 75 Ω BNC connector. This 12G-SDI product, exclusive to Samtec, is engineered for pick-and-place assembly.
While maintaining 12G-SDI performance, Samtec experts modified the weight of the low-profile, right-angle BNC connector to keep it balanced during automated placement without fixturing. The top surface area was also increased for a machine vacuum seal, making the use of industry standard pick-and-place machines possible.
Here is a video that shows these connectors being placed on a PCB. Please note the equipment is running slower than usual to show the connectors and the accurate placement of the connectors to the PCB.
The results of the low profile BNC7T-BM1D are equal to or better than the already excellent results of the edge mount BNC. And we achieve similar results (again, relative to the already strong results of the edge mount BNC) with a Samtec PCB mount right-angle through-hole HDBNC jack and a Samtec PCB mount right-angle through-hole DIN 1.0/2.3 jack.
The demonstration highlights the custom launch design that successfully allows even the more challenging right-angle connector configurations to perform at this high level. With PCB terminated RF connectors, the design of the launch (the transition from the connector to the trace on the board) is critical to the ultimate performance of the RF connection.
Samtec offers custom launch design services to assure the best possible performance of our RF PCB connectors when terminated to our customers’ specific PCB stack and construction. The specific PCB stack dimensions and all materials utilized in the construction of the PCB, including all prepreg and core materials used, the specific weave types of each, and any solder masks etc., are needed in order to perform these services.
Also in the video, Chris compares the results of a connector that meets SMPTE requirements with the same connector on a fully optimized PCB. Note the optimized PCB has roughly the same material, a similar construction, and the same number of layers; the difference is the optimization. Optimization includes the transition to the next component on the board; this reduces additional impedance variations and associated reflections that will reduce performance.
To learn more about 12G-SDI connectors and Samtec’s optimized launch capabilities, please contact the RF Technical Group. These services are available to optimize the performance of any of our BNC, HDBNC, DIN or other 75 Ω series of PCB terminated connectors for your particular PCB stack up, regardless of materials and thickness.
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