You can’t talk about technology without mentioning the need for increased bandwidth and high bandwidth connector design.
On the hardware side, many say we are facing the limits of what we can do with the tried-and-true technologies that have been the foundation for technology innovation thus far — chips, laminates, boards and elements associated with them.
Addressing increased bandwidth requirements requires a systems-level approach. Those systems are defined by the hardware elements noted above. We have reached the point where any discussion regarding the “systems-level approach” for next generation hardware technology development has to include interconnects and cable assemblies as key elements within the design puzzle.
Check out this article in EDN from Brian Vicich, Samtec’s VP of Engineering.
Brian discusses the strategies, tactics and components necessary to design interconnects that can effectively achieve higher bandwidths and not be bottlenecks in high speed systems.
Other links that may be of interest:
- Bandwidth Demand Drives Connector Design article
- Strike Up The Bandwidth Beyond 28 Gbps article
- More about Samtec Signal Integrity
- Teraspeed Consulting
- Questions about high bandwidth interconnect systems? Contact the Signal Integrity Group.
- Samtec Microelectronics
- EDN