EDI CON USA brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, product demonstrations, training, and learning opportunities. And as you have probably already guessed, Samtec will be attending EDI CON. We will be presenting two workshops (more on this below), displaying and demonstrating our RF interconnect solutions, including our expanding line of precision RF interconnects, as well as high-speed/high-density interconnect systems.
BTW, the exhibition and conference runs from October 17-18 at the Santa Clara Convention Center. Samtec is at booth #405.
Both workshops are on Thursday, 18 October, in room 209.
Workshop 1: Evaluating Connector Crosstalk Impact on System Crosstalk at 32Gbps (PCIE Gen5)
(Thursday, 18 October, 12:55 – 1:35 pm, Room 209)
Crosstalk resonances emanating from connector height have always been present and now appear within the proposed operating bandwidth of PCIe Gen 5.0 (32GT/s). Such resonances are often narrow band, and can violate legacy frequency domain magnitude limits regardless if system performance is impacted. This workshop covers a spectral-weighted method, including Integrated Crosstalk Noise, that better relate crosstalk profiles of a component to degradations to channel performance. Connector performances are validated with Seasim in full PCI Express 5.0 channels. Presenter: Steve Krooswyk
Workshop 2: Increasing Broadband Interconnect Characterization up to 60GHz
(Thursday, 18 October, 2:25 – 3:05 pm, Room 209)
VNA measurements are the backbone of any SI analysis, both for correlation and basic interconnect understanding. As bit rate increases and specs tighten, accurate measurement at higher frequencies is of paramount importance. For convenience, a coaxial style connector is often used to interface the DUT. This introduces discontinuities along the signal path that can severely affect the maximum measurement bandwidth. In this work we study the interface discontinuities that limit bandwidth from the connector to the PCB launch. We propose a PCB launch design pattern that enables measurement up to 60GHz and we show with the help of measurements, CT-SCANs, and simulations how PCB manufacturing variations can dramatically affect the effective measurement bandwidth. Presenter: Gustavo Blando
New Precision RF Interconnects
New precision RF interconnect products that will be on display include 3.50 mm, 2.92 mm, SMP, 2.40 mm, 1.85 mm, SMPM and 1.0 mm. This is in addition to our full line of 50 Ω and 75 Ω connectors and cable assemblies, and Bulls Eye® high-performance test point systems.
Check-out Samtec’s 28 Gbps Product Demonstrator. It is a small version of a real system that uses active retiming devices at 28 Gbps, for short reach and medium reach channels, and it incorporates most of Samtec’s 28 Gbps+ products.
The demonstrator concurrently generates 80 PRBS31 signals at 28 Gbps. Each signal passes through one or more Samtec connectors, and we measure bit errors, signal amplitude, and eye patterns, all in real-time. The 28 Gbps Product Demonstrator is a fully packaged system that uses modern, real-world signal integrity design practices, automated design processes, and shows multiple IEEE 100 G channels passing through Samtec mezzanine and Flyover™ products.
If you’re at EDI CON please visit us in booth 405. If you can’t attend but want to learn more about the products, demos, and workshops above, you can get in touch with these friendly people from Samtec:
- RF Products: The RF Group
- High-speed products: The Signal Integrity Group
- 28 G Demonstrator: Teraspeed Consulting