HPC is the underpinning for many of today’s most exciting new research areas, from machine learning to artificial intelligence to quantum computing. Scientists, researchers, and data analysts from academia, industry and government agencies will be center stage at SC20.
As data rate requirements approach and surpass 112 Gbps PAM4, developers are challenged with balancing increasing throughput, scalability and density demands with concerns such as power consumption, signal integrity, thermal management, cost and time-to-market. Samtec helps address these challenges with industry-leading expertise in high-performance interconnect design, and innovative strategies and technologies for the demands of next generation data transmission.
The following are links to live product demonstrations, products, and technologies, that are on display at the Samtec Virtual booth at SC20.
Virtual Demonstrations, Presentation
PCIe Gen 4 Over Fiber Adapter Card: Samtec and Dolphin
UCLA’s Ocean High-Throughput Processor in the CMS Experiment at the CERN Large Hadron Collider
Thermal Management of HPC Hardware Architectures via Immersion Cooling
32 GT/s PCIe® 5.0 Link Training on PLDA’s PCIe 5.0 Controller using Samtec Connectors
Live Demonstrations From SC19
- Chassis-to-Chassis, Mid-Board Connectivity Via 5 Meter Cable Backplane
- Embedded Optical Development Platform For FMC+
- Full-Scale Immersion Cooling of Optical Transceiver, PCBs
- 56 Gbps PAM4 Connector Product Demonstration
New and Important Connector Products At SC20
FireFly™ Micro Flyover System™: FireFly is the first interconnect system that gives designers the flexibility of using micro footprint high-performance optical and low-cost copper interconnects interchangeably with the same connector system.
FireFly optical products provide performance to 28 Gbps, x4 and x12 designs, a variety of end 2 options, a variety of heat sinks, extended temperature designs for military and industrial applications, and PCIe-over-fiber optical cable systems.
NovaRay® Extreme Density Arrays combine extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays. The fully-shielded differential pair design and two reliable points of contact contribute to the industry leading 4.0 Tbps aggregate data rate.
Si-Fly™ is a 112 Gbps PAM4, low-profile, high-density cable system. Si-Fly’s on-package direct connect technology enables speeds of 25.6 TB aggregate, with a path to 51.2 TB. The signal channel eludes the BGA, routing directly from the IC package through a long-reach cable offering 5x the reach of traditional PCB topologies.
AcceleRate® is the industry’s slimmest cable system (7.6 mm wide) with direct attach technology and ultra-low skew twinax cable for 56 Gbps PAM4 speeds. This eliminates the need and variability of a transition card for improved signal integrity.
AcceleRate HD is a .635 mm high-density, multi-row mezzanine strip with up to 240 I/Os and a small footprint.
AcceleRate High-Performance Arrays are 0.635 mm pitch arrays with 112 Gbps PAM4 extreme performance and a flexible open-pin-field design.
ExaMAX® high-density backplane systems offer design flexibility to fit a variety of applications, including Flyover cable supporting 112 Gbps PAM4 and board-to-board supporting 56 Gbps PAM4.
Samtec Flyover® Technology: As bandwidth requirements rapidly increase, effectively managing heat and routing signals through lossy PCBs, vias and other components have become complex challenges. Samtec Flyover systems can help extend signal reach and density to achieve next gen speeds by routing signals via ultra-low skew twinax cable instead of through the PCB. Samtec’s proprietary co-extruded Eye Speed® twinax cable technology eliminates the performance limitations and inconsistencies of individually extruded dielectric twinax cabling. It also improves signal integrity, bandwidth and reach for high-performance system architectures.
We hope you enjoy the show!