Years ago it was a big deal when Samtec released a new catalog. It was a chance to showcase new connectors, new technologies, and new services. Obviously our digital world has greatly reduced the need for printed materials. But, while it’s down considerably from previous years, there’s still demand for our printed catalogs.
Did I just say that there’s still people who read printed catalogs? Yes, I did.
According to Harvard Business Review, catalog mailings have been on the increase since 2015. A recent article in Forbes identifies several reasons why people like printed catalogs. For example, printed materials are tactile; they feel different than a hand-held device, and you get to turn pages. Also, for many, it’s simply a break from staring at a screen.
A Digital Media Solutions article notes that Millennials are embracing print, saying perhaps “as a result of cluttered email inboxes, Millennials welcome print mail into their homes.”
Anyway, the reason I’m telling you about our new catalog is to tell you about the new connectors in it. Below is a quick list of some of those new products. And isn’t it interesting that I’m giving you links to click if you want to learn more about that product? I’m not telling you what page number to turn to …
NovaRay® Extreme Density Arrays: These bad boys combine extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays. There’s the NVAC cable assembly, NVAM-C mating connector for the cable, the NVAF socket, and NVAM terminal.
AccleRate®-HP High Performance Arrays: These 0.635 mm pitch arrays feature 112 Gbps PAM4 performance and a flexible open-pin-field design. There’s the APM6 terminal and APF6 socket.
ExaMAX® High-Speed Backplane Cable Assemblies: ExaMAX high-density backplane systems offer design flexibility to fit a variety of applications, including Samtec Flyover® cable systems supporting 112 Gbps PAM4 and board-to-board supporting 56 Gbps PAM4. In the 2021 catalog you will find the EBCF and EBCM, backplane cable socket and header, respectively.
PCI Express® 4.0 and 5.0 Sockets: There’s the PCIE-G4 and PCIE-G5 edge card sockets, for Gen 4.0 and 5.0, respectively.
Edge Rate® High Speed Mezzanine: Samtec’s Edge Rate contact system is designed for high speed, high cycle applications. A new .635 mm pitch connector system is the ERM6 and ERF6.
FQSFP-DD Double Desnity QSFP: The FQSFP-DD is a Double Density Samtec Flyover® QSFP Cable System.
mPower® Micro (ala Space Saving) Power Cable Assemblies: The UMPC is a cable assembly for power applications, but it saves space.
1 mm Pitch Discrete Wire Cable Assemblies: This space-saving discrete wire system supports cable-to-board, cable-to-cable and cable-to-panel applications. Here’s a list of the new connectors:
- IDP1: 1 mm pitch double row panel mount housing
- IDT1: 1 mm pitch double row terminal housing
- ISP1: 1 mm pitch single row panel mount housing
- IST1: 1 mm pitch single row terminal housing
- T1PD: 1 mm pitch panel mount terminal, double row
- T1PS: 1 mm pitch panel mount terminal, single row
- T1SD: 1 mm pitch terminal assembly, double row
- T1SS: 1 mm pitch terminal assembly, single row
Here’s a few other links that may interest you:
Leave a Reply