Enough of the letter "P" already. Message recieved. In any case, modeling and simulating next-gen 224 Gbps signal channels poses many challenges. Design engineers must optimize the entire signal path, not just a specific component. The signal path includes transceiver and receivers, die-to-packaging transitions, BGA breakout regions, PCB traces, connector breakout regions and interconnect. Any number of design decisions affect multi-gigabit per second channel data rate performance. As a … [Read more...]