Interposers have a long history in microelectronics packaging.  Legacy interposers help connect small pitch ICs or silicon die to wider pitch sockets or packages.  While this approach started with the earliest PC MCUs, many common ICs, including FPGAs, NAND, DDR and others, use BGA packages as an interposer. As IC pin and solder-ball pitches have decreased, interposer adoption in various applications continues to increase. Highly complex consumer devices require high density, low … [Read more...]