Pundits in the semiconductor industry consistently debate the status of Moore’s Law. Does it still apply? For how long? How will x86 architectures be affected?
These are ongoing questions and concerns for Wall Street and Silicon Valley. The answers will have economic, technological and societal impacts.
However, not all end-market electronic devices require a server CPU coupled with a GPU or FPGA accelerator. Sometimes, just a standard, general purpose microprocessor will do.
ST Microelectronics STM32MP1 Series
ST Micro’s new STM32MP1 series has been developed for a number of everyday applications. It features
This simple approach balances performance and power figures for any number of IoT and industrial applications. Popular open-source OS solutions can run on the the Cortex-A7 core while the Cortex-M4 core leverages the vast STM32 MCU ecosystem.
STM32MP157C-EV1 Evaluation Board
The STM32MP157A-EV1 and STM32MP157C-EV1 Evaluation boards are the full-feature demonstration and development platforms for STMicroelectronics Arm®-based dual Cortex®-A7 32 bits and Cortex®-M4 32 bits MPUs in the STM32MP1 Series.
As a full-feature demonstration and development platform, the STM32MP157C-EV1 motherboard contains many expansion connections for industry-standard protocols. Of note, some interfaces feature Samtec mezzanine strip connectors.
Mezzanine Strips on STM32MP157C-EV1
One example is the LTDC expansion bus. This provides common control lines and data access for a standard LCD-TFT. The STM32MP157C-EV1 motherboard uses Samtec QSH series 0.50 mm Q Strip® High-Speed Ground Plane Socket Strips for this connection.
Another access port on the STM32MP157C-EV1 motherboard offers Ethernet connectivity. This interface uses a Samtec ERF8 series 0.80 mm Edge Rate® Rugged High-Speed Socket Strip for access.
Samtec makes a variety of board-to-board mezzanine strips. These solutions can achieve data rates of 56 Gbps PAM4 and beyond. Additional features include:
- Integral ground planes
- Rugged Edge Rate® contacts
- Slim body widths
- Low profile stack heights
For more information on these and other mezzanine solutions, please download the High-speed Board-to-Board Interconnect Solutions Guide.