When faced with the need for more of something, one possible solution is expansion. This could take many forms but one simple way is extending it to be greater in size, such as adding the dining room table leaves to fit more people around the Thanksgiving table.
Samtec’s SEARAY™ product family is already the industry’s largest offering of high-speed, high-density, open-pin-field arrays, but there’s always room for more at the table. The addition of a 7.5 mm body height for the vertical socket (SEAF) increases design flexibility with several new stack heights: 10.5 mm, 11 mm, 14.5 mm, 16.5 mm and 18.5 mm.
With stack heights now from 7 mm to 18.5 mm, SEARAY™ open-pin-field arrays (SEAF/SEAM) feature a .050″ x .050″ (1.27 mm x 1.27 mm) pitch for maximum grounding and routing flexibility. Rated for speeds up to 56 Gbps PAM4/28 Gbps NRZ, this system is available with up to 560 Edge Rate® contacts and solder charged terminations for ease of processing. Press-fit tails also are available (SEAMP/SEAFP).
Edge Rate® Contact System
The smooth, broad, milled mating surface of the Edge Rate® contacts minimizes the effects of broadside coupling, which decrease crosstalk for superior signal integrity performance. Increased impedance control is achieved by a straight, consistent material cross-section. Robust when mating and unmating, this contact system also features a long contact wipe up to 1.5 mm, which improves the mating angle tolerance. In addition, Edge Rate® contacts are suitable for a variety of high-speed protocols and standards.
SEARAY™ Product Family
Samtec’s other high-density arrays are rated to 56 Gbps PAM4/28 Gbps NRZ performance for high-speed applications. SEARAY™ 0.80 mm pitch arrays (SEAM8/SEAF8) provide 2x the density of .050″ (1.27 mm) pitch SEARAY™ with up to 720 Edge Rate® contacts and choice of 7 mm or 10 mm stack heights. LP Array™ low-profile arrays (LPAM/LPAF) are available in 4 mm, 4.5 mm and 5 mm stack heights with up to 400 total I/Os.
The full line of SEARAY™ products also includes an 85 Ω tuned interconnect (SEAMI Series) with a choice of 320, 400 or 500 total I/Os. Elevated board stacking to 40 mm is achieved with Samtec’s high-density riser (SEAR). Power/signal combinations are possible with additional power modules (UBPT/UBPS). Jack screw standoffs (JSO/JSOM) can assist with unmating and reduce the risk of component damage on boards.
Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to ensure complete system optimization from Silicon-to-Silicon. The Signal Integrity Group (SIG) and Advanced Interconnect Design (AID) technology centers provide application support for high-density arrays and many other products. Highly qualified Signal Integrity engineers help with full-channel analysis, high-data rate simulations, application-specific design and development assistance, and advanced design support. AID ensures interconnect systems are designed for quality, design flexibility, ease of processing and even supply chain risk management.
You can read more about SEARAY™ products in the High-Speed Board-to-Board Guide.