Samtec, Inc. is pleased to announce an agreement with Hirose Electric USA, Inc. as a second source for Samtec’s FireFly™ Micro Flyover System™. As a certified independent second source, Hirose can now provide its customers a future-proof … [Read more]
Another DesignCon 2015 Paper – Causality Demystified (Best Paper Award Finalist)
Samtec and Teraspeed Consulting presented several papers at DesignCon 2015. One paper, "Causality Demystified," was a DesignCon 2015 Best Paper Award Finalist. Download the Causality Demystified paper from DesignCon 2015 Here's a summary if you … [Read more]
DesignCon 2015 Paper Now Available – “Optimizing Symmetry In Open Pin Field Designs
Samtec and Teraspeed Consulting presented several papers at DesignCon 2015. The first is "Optimizing Symmetry In Open Pin Field Designs." This paper presents a process for analyzing open field array structures. Various modes of propagation and … [Read more]
DesignCon 2015 Paper – Anisotropic Design Considerations For 28 Gbps Via to Stripline Transitions
Teraspeed Consulting and Samtec presented several papers at DesignCon 2015. Here's a link to "Anisotropic Design Considerations For 28 Gbps Via to Stripline Transitions." For 28-56 Gb/s design the homogeneous isotropic material assumption is a key … [Read more]
28 Gbps Backplane Demo Using Virtex UltraScale FPGAs and Samtec Backplane System
Check out this Xilinx blog post about a 28 Gbps backplane demo using two Xilinx VCU 109 eval boards talking to each other over a Samtec backplane system. This was at the Teraspeed (Samtec) booth at DesignCon 2015. Nice video! … [Read more]
“Causality De-Mystified” Is Best Paper Finalist At DesignCon 2015
Samtec’s paper “Causality De-Mystified” has been selected as a finalist for a Best Paper Award at DesignCon 2015. The papers are ranked in terms of Quality, Relevance, Impact, Originality and Commercial Content with the aggregate score determining … [Read more]
Papers, Product Demos, New Products At DesignCon 2015
Samtec, Inc., and Teraspeed® Consulting are presenting five technical papers, giving two physical high speed product demonstrations, and showcasing several new products at DesignCon 2015. Samtec’s new location is booth #943, and Teraspeed® Consulting … [Read more]
60A Power Socket Now Available With Press Fit Termination
Samtec’s line of PowerStrip™ interconnects includes the EXTreme Ten60Power™ socket and terminal system that delivers high current power performance of up to 60A per power blade (1 blade powered at 75ºC; 30ºC Temperature Rise). These interconnects … [Read more]
Samtec Demos PCIe Gen 3 Over Fiber At SC14
If you are at SC14 (SuperComputing) in New Orleans, swing by the Samtec booth (#956) and check out our two demos. One of them demonstrates remote PCI Express® (PCIe®) Gen 3 switching over fiber. The system demonstrated achieves x8 PCIe® Gen 3 data … [Read more]
12G SDI FPGA Mezzanine Card Targeting Xilinx Platforms
Fidus Electronic Development and inrevium has introduced the TB-FMCH-12GSDI, a 6G/12G SDI FPGA Mezzanine Card (FMC) targeting Xilinx platforms. Fidus uses six, 75 ohm Samtec HDBNC connectors, as well as SEARAY™ interconnect systems as specified in … [Read more]