Samtec has provided packaging solutions for Integrated Circuits (IC), Microelectromechanical Systems (MEMS), Biomedical MEMS (BioMEMS), and Application-Specific Sensors products. The use of good Design for Manufacturability (DfM) is essential for ease of manufacturing, reliability, and performance reasons.
In the case of Samtec’s Glass Core Technology (GCT), MEMS and Sensors have used glass as a substrate, capping material, and as an interposer for its Coefficient of Thermal Expansion matching, low dielectric properties, and optical transparency properties. As more electro-optical, photonic, and 5G/Millimeter Wave (mmWave) devices evolve, glass interposers have a major role in successful product integration.
The following are addistional references for Samtec’s role in MEMS and Sensor productization: