![](https://blog.samtec.com/wp-content/uploads/2020/05/ECTC-Banner-scaled.jpg)
Samtec has provided packaging solutions for Integrated Circuits (IC), Microelectromechanical Systems (MEMS), Biomedical MEMS (BioMEMS), and Application-Specific Sensors products. The use of good Design for Manufacturability (DfM) is essential for ease of manufacturing, reliability, and performance reasons.
![Glass Core Technology](https://blog.samtec.com/wp-content/uploads/2017/08/glass-core-technology-samtec.jpg)
In the case of Samtec’s Glass Core Technology (GCT), MEMS and Sensors have used glass as a substrate, capping material, and as an interposer for its Coefficient of Thermal Expansion matching, low dielectric properties, and optical transparency properties. As more electro-optical, photonic, and 5G/Millimeter Wave (mmWave) devices evolve, glass interposers have a major role in successful product integration.
The following are addistional references for Samtec’s role in MEMS and Sensor productization: