Is teleportation really just hypothetical? Please consider… by the 24th century, Star Trek’s “Transporter” will become “the safest way to travel” at 2 to 2.5 seconds of typical transport time up to 40,000 kilometers away. Just say, “Beam me up, Scotty.”
And let’s not forget Wonka Vision. Little Mike Teavee shrunk and transported himself into the television like one of Willy Wonka’s oversized chocolate bars. Then he went to the taffy puller to be made normal size again in no time.
Okay, teleportation (at least the kind that doesn’t require taffy pullers) is much further in the future than I’d like. Self-driving or even flying cars have nothing on 2.5 seconds of travel time, right?! Let’s figure that out.
Until then, much closer to reality than teleportation is Samtec’s direct connect technology, which includes two interconnects: FireFly™ and Si-Fly™. Available now are FireFly™ copper and optical solutions with performance to 28 Gbps NRZ/56 Gbps PAM4.
Currently in development is Si-Fly™ copper (available 2020), with optical to follow, for channel performance to 112 Gbps PAM4 and beyond.
The on-package direct connect technology used in Samtec’s new Si-Fly™ 112 Gbps PAM4 low profile cable system connects the high-speed signals directly to the silicon package. This eliminates signal distortion by eluding the BGA and routing the signal from the IC Package through long reach cable. Combined with the ultra-high density design, this solution enables an aggregate data rate of 25.6 TB with a path to 51.2 TB.
In addition to extreme performance, Si-Fly™ offers five times the reach of traditional PCB topologies. When measured at 112 Gbps PAM4 with IEEE 802.3cK allowable loss, copper twinax Si-Fly™ achieved a 22-inch reach compared to the 4.5-inch reach of Megtron 7 PCB.
To learn more about Si-Fly™ and Samtec’s direct connect technology, check out this video.