While it may not be as exciting as getting the new phone book, Samtec recently released its new Full-Line Catalog.
Why tell you about a new catalog? For me, it’s cool to see the new products and technologies. Here’s a quick list of some of the new stuff in the catalog:
ExaMAX® Direct Mate Orthogonal Backplane: DMO solutions offer system designers flexibility by removing the mid-plane, allowing fabric cards and line cards to mate directly. This increases airflow and improves thermal efficiencies throughout the chassis, and enhances signal integrity via shorter trace lengths and less connector transitions. These are the EBDM-RA and EBTF-RA series.
High-Speed, Press-Fit Cable Assembly: A high-retention, press-fit system terminates a direct connection to the PCB. The connectorless design eliminates the need for traditional board-level connectors and transition cards leading to simplified BOMs and reduced system costs. It supports and surpasses PCIe® Gen 3 speed at two meters. This is the DCH series.
Flyover™ QSFP28 Cable Assembly: This 28+ Gbps system is backward compatible with all QSFP cable assemblies. Signal integrity is improved and extended by flying critical data over lossy PCB materials. No re-timers are required resulting in reduced costs and power consumption. Check out the FQSFP series and this one page overview.
Flyover QSFP28 Double Density: As advanced ASIC and FPGA solutions hit the market, a next generation module that overcomes the limitations of QSFP needs to perform at 50 Gbps+ per channel. Double density flyover increases throughput over QSFP by adding a second row of contact enabling support for an eight-lane electrical interface. QSFP-DD is also backward compatible with QSFP. This is the FQSFP -DD series.
High Density, High Bandwidth Edge Card Sockets: The industry’s first 0.50 mm pitch edge card with a justification beam that enables the use of standard board tolerance for lower costs and decreases mating tolerance by 50%. It’s rated at 56 Gbps with PAM4, and it’s PCIe® Gen 4 compliant. Check out the MEC5 -DV and MEC5 -RA.
Low Profile PCIE Socket: A new low-profile edge card connector is PCI Express® Gen 4 compliant and supports one, four, eight and sixteen channels for different bandwidth requirements. The low 8 mm profile is 3 mm less than the standard 11 mm profile connector with an identical 3.50 mm contact wipe. This provides more vertical space in a standard size chassis with a set form factor allowing for greater system air flow and space to route other components over the connector. It’s the PCIE -LP series, and here’s more information about it.
PCIe® Mid-Board Optics: Samtec’s FireFly™- based fiber solution offers key features that solve the challenges of transmitting the PCIe® protocol over longer links. The miniature size of Samtec’s high-density optical engines allows them to be easily designed into the downstream system, ultimately making these systems smaller. Here’s an overview of the PCIe® mid-board system. The optical cable system is the PCUO series, and the copper cable is the PCUE series.
40 GHz Bulls Eye®: The only one-piece test solution on the market, with easy-to-use compression interface design and performance to 40 GHz. This is the BE40A, BE40B, and BE40C series. And here’s an overview of the Bulls Eye system.
FYI, most customers view our catalog pages and prints online. We have some great search tools on samtec.com (check out the Picture Search and Solutionator®), and the digital version of the catalog is popular, but we still get a lot of requests for printed catalogs.
Also, some of these products are nearing release, so check with the Application Support Group if you have any questions or need additional information.