COVID-19 is slowly fading away. People are returning to a normal life. Students look forward to summer. Families are planning holidays. Friends and colleagues are sharing meals in restaurants.
In the business world, virtual meetings are still a reality. Yet, many professionals yearn to see their colleagues in person. Slowly but surely, in-person connections are being made via trade shows.
Next week in Nuremburg, the annual embedded world event returns. The Coronavirus Omicron variant flare-up pushed EW22 from its usual March date. However, embedded systems professionals look forward to reconnecting at the industry’s largest global event.
As with past years, Samtec will have a large presence at the event. Samtec’s European and North American colleagues stand ready to discuss smart connections for embedded applications. What will Samtec feature at embedded world 2022?
Samtec ew22 Featured Products
Samtec offers a wide array of copper, RF and optical interconnect solutions ideally suited for embedded computing applications. Several of the featured products are detailed below.
COM-HPC® Interconnect Solutions
The development of COM-HPC exceeds the demand for high-speed performance in embedded computers, and provides scalability for next-gen embedded system designs. COM-HPC interconnects offer 5 mm and 10 mm stack heights, a 400 pin open-pin-field on 0.635 mm pitch, BGA attach, and up to 112 Gbps PAM4 performance
VITA 74 VNX and VITA 90 VNX+ Interconnect Solutions
VITA 74 VNX and VITA 90 VNX+ introduce new approaches to rugged Small Form Factor (SFF) designs. Its unique module-based format offers system architects greater freedom in developing COTS SFF systems. VNX’s machined chassis, robust backplane, and conduction-cooled modules unite to form an extremely rugged assembly.
VITA 88 XMC+ Interconnect Solutions
Based on XMC, VITA 88.0 XMC+ defines an alternative connector from the same family used in FMC/FMC+. While not intermateable with VITA 42.0 connectors, the VITA 88.0 connector is designed to be backward compatible with VITA 42.0 electrical footprints. This allows designers to improve existing VITA 42.0 and/or VITA 61.0 designs by swapping connectors.
Next-generation XMC+ designs utilize an updated solder footprint and blade/beam style contact system. The result is superior SI supporting PCIe® 5.0 (32 GT/s) and 100 GbE operation, and improved mechanical performance and durability. All of this is achievable at stacks up to 18 mm.
Connectivity Solutions for AI/ML Applications
Rapidly-growing technologies like AI/ML are driving new system architectures that demand increased speeds, bandwidths, frequencies and densities, along with scalability and configurability. To meet these challenges, Samtec offers connectivity solutions for next generation AI/ML applications.
Samtec ew22 Product Demonstrations
Several of Samtec interconnect products used in embedded applications support 56 Gbps PAM4 data rates. The following video, narrated by Samtec System Architect Ralph Page, previews many of the active demonstrations Samtec will present at ew22.
Samtec ew22 Technical Presentations
In addition to new releases and product demonstrations, one of the key features of embedded world are technical presentations. Technical experts from Samtec will be present to discuss the following topics.
Practical Design Considerations for PICMG COM-HPC® Carrier Boards
Jun 21, 2022, 10:30 – 11:00 GMT+2 – Exhibitor Forum Hall 1: Booth nr. 1-500 | LIVESTREAM
High-Performance Interconnects for Embedded AI/ML
Jun 21, 2022, 17:00 – 17:30 GMT+2 – Exhibitor Forum Hall 1: Booth nr. 1-500 | LIVESTREAM
New VITA 74 VNX/VITA 90 VNX+ Standards Offer Alternative Infrastructure for Rugged Computing Applications
Jun 22, 2022, 10:30 – 11:00 GMT+2 – Exhibitor Forum Hall 1: Booth nr. 1-500 | LIVESTREAM
VITA 88 XMC+ Enables PCI Express® 5.0 Performance in Rugged Computing Applications
Jun 23, 2022, 10:30 – 11:00 GMT+2 – Exhibitor Forum Hall 1: Booth nr. 1-500 | LIVESTREAM
Visit Us at ew22!
All Samtec blog readers are invited to visit with Samtec at ew22 in Nurenburg. Stop by Hall: 4A Booth: 4A-324 the event. Register here for tickets.
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