Datacom Connectors and AI

The rise of Artificial intelligence or AI has hit the headlines with ground-breaking advances enabling data analysis, pattern recognition, robotic automation and perceptual awareness. With a growing number of possible uses that are taking this technology beyond the computer screen and into the wider world, AI-enabled applications will require secure datacom connections that can deliver high performance in demanding environments.

AI is rapidly becoming an essential tool for an ever-increasing number of applications in the real world. Publicly accessed AI tools are provided by data centers and delivered by a web browser. Modern embedded computing uses system-on-module (SoM) and computer-on-module (CoM) architectures to deliver ultra-low latency and high speed at the point of need. AI systems consist of multiple SoMs and CoMs, and many of these new systems require increased speed and high-density footprints.

Within the data center, AI applications are driving the development of new system architectures and topologies that will deliver increased speeds, greater bandwidth, and higher frequencies. These architectures will depend on the ability to quickly reconfigure to respond to the increasing demands that the growth of AI will generate. Emerging application-specific AI hardware systems require optimized channel performance to support increased data rates.

Samtec is at the cutting edge of development for all forms of high-speed communication, whether over printed circuit boards, copper cables or optical fiber. Our full portfolio of high-performance cables and connectors supports the bandwidth, scalability and density demanded by the latest generation of AI topologies. High-speed connectors and high-performance cable systems are available that support the full range of industry-standard form factors, including PCIe® CEM AIC and PECFF.

You can find out more about how Samtec’s interconnect solutions are advancing AI technology on the Datacom industry page. This is the hub for a range of information on Samtec’s high-speed solutions suitable for the new topologies and the broad spread of communication applications.

To help the customer, we have published the Artificial Intelligence Solutions Guide. In its pages, you will find a guide to understanding some of the new architectures optimized for AI and ML applications. We also talk about the alternative solutions for providing high-speed data, from traditional board and mezzanine connectors, through copper cabling and the latest optical technologies. We also showcase some of the other essential information needed for the latest AI systems, from power connectors and test and measurement to a thorough understanding of the latest standards.

Samtec prides itself on delivering an integrated business that helps customers take advantage of AI, one of the most exciting innovations of this century. To take advantage of this in-house expertise and a complete range of high-performance connectivity, keep visiting Samtec.com to ensure that you stay up to date with the latest developments from Samtec.