Samtec is expanding its line of ExaMAX® high speed backplane connectors. The new system is a direct mate orthogonal (DMO) configuration. These products were recently on display at SC17 in Denver. In the video above, Jonathan Sprigler, Samtec’s Backplane Product Manager, tells us about the products, their applications, and how they are optimized for speeds…
The 28 Gbps Product Demonstrator is an active system that showcases a variety of Samtec interconnect products at 28 Gbps and beyond. The Demonstrator was up and running at SC17, and Anthony Fellbaum was there also, where he walked us through the demo. Real World 28 Gbps This demonstration is different from those of other…
Networking switches and hubs in next-generation hyperscale data centers must support increased port density and higher data rates. In combination with increased processing power, system designers are leveraging the inherent advantages of direct mate orthogonal architectures when compared with traditional backplane systems. Samtec supports orthogonal backplane architectures with new DMO options from within the ExaMAX® High-Speed…
Who doesn’t like something new? Maybe it’s that new smell, a new flavor, or a new feature that draws you in each and every time. Well, we love new things around here and are excited to share the new Product Overview Guide. It might not smell or taste new, but it is packed with new…
Samtec released Silicon-to-Silicon™ System Optimization Microsite in early 2016. This one-stop shop summarizes all of Samtec’s Silicon-to-Silicon™ System Optimization capabilities. It provides engineers the service, products, tools and resources to optimize the entire signal chain of a system, from bare die to IC package and assembly, to PCB, connectors and cable assemblies, and back again. The…
DesignCon 2017 is next week in San Jose, California. If you’re going to be there, here are 7 reasons to visit us at booth 717. They’re all good reasons, and #5 is really cool, but it may not actually blow your mind. Sorry. Like me, you’ve probably seen the “sponsored articles” at the bottom of…
DesignCon 2017 is right around the corner. As in past years, Samtec will have a large presence throughout the event. Our SI experts will present technical papers. Our application engineers will demonstrate new system-level solutions. Our product experts will discuss various new and emerging products that will be released throughout 2017. And if I’m…
Samtec proudly announces the expansion of the ExaMAX® High-Speed Backplane Connector System optimized for high-density and high-speed performance. The scalable ExaMAX® system meets today’s data rates while providing a future-proof path for next generation architectures. The ExaMAX® header and right-angle receptacle system (EBTM/EBTF-RA Series) is optimized for speeds up to 28 Gbps on a 2.00…
Samtec is pleased to announce a new ChalkTalk entitled “Expanding the Backplane Ecosystem.” Hosted by EEJournal, this newly released ChalkTalk details the growing backplane connector portfolio from Samtec. Samtec entered the backplane connector market by licensing FCI’s ExaMAX® High-Speed Backplane Connector System. Over the past few years, Samtec has developed numerous soon-to-be-released backplane connector mated pairs. Samtec…
Samtec continues to expand its capabilities in support of backplane connector applications. In addition to our recent announcement with Amphenol, we continue to augment the ecosystem of support required for these high-speed, high-performance products. When we announced the initial release of Channelyzer™ – Samtec’s Online Full Channel Simulation and Analysis tool – earlier this year, the tool initially supported…
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