Increasing data rates, denser systems and shrinking product footprints challenge designers to meet their system signal integrity needs. Samtec’s Silicon-to-Silicon™ System Optimization capabilities provide engineers the service, products, tools and resources to optimize the entire signal chain of a system, from bare die to IC package and assembly, to PCB, to connectors and cable assemblies,…
Higher data rates in today’s bleeding edge ICs require constant innovation in interconnect to route signals on PCBS and between them. Samtec’s Silicon to Silicon System Optimization provides engineers the service, products, tools and resources to optimize the entire signal path from bare die to IC package and assembly to PCB to connectors and cable…
Check out this Xilinx blog post about a 28 Gbps backplane demo using two Xilinx VCU 109 eval boards talking to each other over a Samtec backplane system. This was at the Teraspeed (Samtec) booth at DesignCon 2015. Nice video!
Samtec and FCI announced the signing of a second-source agreement for Samtec to manufacture, market and sell FCI’s ExaMAX® high speed backplane system. We will keep you posted as more details become available. View The Full Press Release PDF Click here for a product overview: http://samtec.com/examax
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