Samtec, Inc., and Teraspeed® Consulting are presenting five technical papers, giving two physical high speed product demonstrations, and showcasing several new products at DesignCon 2015. Samtec’s new location is booth #943, and Teraspeed® Consulting … [Read more]
60A Power Socket Now Available With Press Fit Termination
Samtec’s line of PowerStrip™ interconnects includes the EXTreme Ten60Power™ socket and terminal system that delivers high current power performance of up to 60A per power blade (1 blade powered at 75ºC; 30ºC Temperature Rise). These interconnects … [Read more]
Samtec Demos PCIe Gen 3 Over Fiber At SC14
If you are at SC14 (SuperComputing) in New Orleans, swing by the Samtec booth (#956) and check out our two demos. One of them demonstrates remote PCI Express® (PCIe®) Gen 3 switching over fiber. The system demonstrated achieves x8 PCIe® Gen 3 data … [Read more]
12G SDI FPGA Mezzanine Card Targeting Xilinx Platforms
Fidus Electronic Development and inrevium has introduced the TB-FMCH-12GSDI, a 6G/12G SDI FPGA Mezzanine Card (FMC) targeting Xilinx platforms. Fidus uses six, 75 ohm Samtec HDBNC connectors, as well as SEARAY™ interconnect systems as specified in … [Read more]
0,80 mm Pitch Discrete Wire System Offers High Reliability with Space Savings
Samtec recently expanded its line of Tiger Eye™ products with a 0,80 mm pitch discrete wire system ideal for rugged applications where a highly reliable connection must be maintained. The micro pitch system increases contact density for greater space … [Read more]
New Panel Mount Discrete Wire Cable Assembly
Samtec recently released a new panel mount discrete wire cable assembly as part of its Mini Mate® product family. This new panel mount discrete wire assembly is ideal for in-line connections required to pass through a panel. The assembly accommodates … [Read more]
Samtec, FCI Sign Second Source Pact For ExaMAX
Samtec and FCI announced the signing of a second-source agreement for Samtec to manufacture, market and sell FCI’s ExaMAX® high speed backplane system. We will keep you posted as more details become available. View The Full Press Release … [Read more]
Julian Ferry Interview On High Speed Interconnect Design Developments
Julian Ferry, Samtec’s High Speed R&D Manager, recently spoke to Connector Supplier about the latest developments in high speed interconnects, the applications driving them, and how Samtec is meeting the challenges. Here is a full copy of the … [Read more]
Sealed, High Density IP67 Mini Push-Pull System
Samtec's new AccliMate™ Sealed Mini Push-Pull system is IP67 protected against dust and water, making it ideal for harsh environments and high density applications. The system is constructed of lightweight plastic and designed with a small round form … [Read more]
High Density SEARAY™ .8 Saves 50% Board Space
Samtec's ultra high density open pin field arrays, created on an 0,80 mm pitch can save you up to 50% board space compared to standard 1,27 mm pitch grid arrays. High density socket arrays, our SEAF8 Series, and terminal arrays, our SEAM8 Series, … [Read more]