In grade school, we had timed math quizzes. With a sheet full of problems and the timer set, the goal was to answer as many as possible. The key to speed is TONS of practice and, honestly, memorization – knowing the problems so well that the answer comes to mind at first glance.
Similar to me sitting at the kitchen table learning the times table to ace the next quiz, rapidly increasing signal integrity requirements have driven Samtec to internally develop hardware for high-level testing of our own interconnect solutions. The result is a unique understanding of the demands and challenges in advanced test instrumentation. Studying the problem seems to really pay off.
We recently released a new Test Connectivity web experience where you can explore more about Samtec’s Test & Development expertise, dig into high-performance interconnect solutions ideal for next-gen test platforms, and discover how our industry-leading SI support can help with your test connectivity application.
HIGH-PERFORMANCE INTERCONNECT SOLUTIONS
5G Networking, HPC/AI, Automotive 2.0 and IoT are driving unprecedented industry growth with massive increases in bandwidth, frequency and density requirements. The new system architecture complexities have increased the demand for advanced production test systems for semiconductors, module hardware, connectors and cables.
Samtec offers a wide range of high-performance connectivity solutions including cost-effective, high-pin-count, extreme performance/density, and high mating cycle interconnects.
- High-Speed Board-to-Board & Edge Card Connectors
- High-Density Arrays & High-Speed Interposers
- High-Density & Extreme Performance Cable Systems
- Micro Coax and Twinax Cable Assemblies
- High-Performance RF Test & Precision RF
FULL SYSTEM SUPPORT
Next-gen test platforms are being built for measurement stability and accuracy by simulating real-world conditions to keep up with the industry’s pace. In order to achieve this, the platform must provide reliable hardware, flexible I/O, high-bandwidth and enhanced processing speeds.
Samtec’s Signal Integrity Engineers can help address these next-gen design challenges with industry-leading expertise in high-performance interconnect systems, plus system optimization support.
- Signal Integrity Services & Support
- Testing & Validation Capabilities
- Signal Integrity Design & Development Tools
NEXT GENERATION TEST APPLICATIONS
As you explore the new Test Connectivity web experience, click through the Applications to learn more about how the combination of Samtec’s expertise, high-performance solutions and SI support can assist with your next-gen test application.
Semiconductor Test Solutions Storage Drive Testing Solutions
To discover more about Test Connectivity, check out these other resources:
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