Readers of the Samtec blog know how excited we get talking about our FireFly™ Micro Flyover System™ and the optical engine technology included in FireFly. Sometimes we forget to talk about our other optical products. In recent weeks, Samtec has added to our repertoire of optical product offerings via some product line extensions and new…
Samtec’s new high speed, high density right angle socket array – SEARAY™ 0.80 mm pitch – is ideal for perpendicular board-to-board and micro backplane applications with up to 50 percent board space savings compared to .050″ (1.27 mm) pitch SEARAY™ interconnects. The open pin field design allows for maximum grounding and routing flexibility with up to 500…
Semiconductor manufacturers are always looking for the best interconnect solution to characterize the high-speed transceivers found on their FPGAs, ASICs and ASSPs. Typically, PCB-mount SMA connectors have been used to breakout the differential transmit and receive signals found in modern transceivers. Below is a Xilinx Spartan-6 FPGA SP623 Characterization Kit which features a number of PCB-mount…
I caught up with Chuck Petersen, Vice President at Epix Inc. Epix designs and manufactures high speed cameras, frame grabbers (boards that are installed into computer slots for image capture from a camera), and software for image capture and processing. The typical Epix customer uses these products for manufacturing assembly line inspections, but they are…
Check out the new Samtec Cable Group Tech Center video. It’s an overview of the Samtec Cable Group, our R&D and manufacturing Technology Center focusing on precision extruded micro coax and twinax cable used for high speed / high density cable assemblies, including 26-38 AWG, 50/75/85/100 ohm impedance, and systems rated at 28+ Gbps. Cable…
Samtec and Amphenol® Aerospace recently announced a partnership to incorporate Samtec’s FireFly™ optical cable platform with Amphenol® Aerospace’s bulkhead interconnects for rugged optic solutions. Click here to read the official press release. FireFly™ Samtec’s FireFly™ is a mid-board cable and optical interconnect system. FireFly™ is incredibly dense, and it enables chip-to-chip, board-to-board, and system-to-board connectivity using the…
Samtec’s new SEARAY™ 0.80 mm pitch ultra-high density array cable assemblies provide 50% board space savings compared to 1.27 mm pitch systems. With performance to 15 Gbps and up to 300 total Edge Rate® contacts, this cable system is designed for rugged high speed applications where space is limited. High Speed Cable Assembly SEARAY™ 0.80…
Samtec’s SEARAY™ high density, high-speed array interconnect is now available in a right angle, press-fit design. SEARAY™ The SEARAY™ high speed array system is a 1.27 mm pitch open pin field array for maximum grounding and routing flexibility. It is available with up to 500 I/Os, and the rugged Edge Rate® contact has low insertion…
Samtec helps engineers design high performance electronic systems. With the recent integration of Teraspeed® Consulting into the Samtec family, we now provide more access to our advanced systems design research, helpful videos, conference presentations, white papers, etc. Here’s a link to two videos you should check out. Scott McMorrow, an R&D Consultant for Teraspeed® Consulting,…
If you’re reading this, chances are you work with board level interconnects and are familiar with design and processing issues that affect them. If your job doesn’t require you to work with connectors, but you’re still reading this, then you are probably messed up and need some type of professional help. Assuming you’re in the…
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