Artificial Intelligence. Or, the intelligence of computers. It’s all around us, but I think it’s important to remember that this intelligence is driven by human intelligence. It’s the human innovation behind AI that’s inspiring creation, adaptation and the use of computers to make our lives easier. By letting computers focus on artificially intelligent tasks, we can spend more time focusing on human connections, family, seeing new sites and sharing those adventures with “our village”. AI can … [Read more...]
Connectors for HPC and Supercomputing
Our modern industrial world depends on raw materials. Whether oil, steel or cotton, raw materials have been of huge importance to the development of the industriaized world. While these physical products remain as vital as ever, the modern era has brought us a new raw material in the form of data. As consumers, we are familiar with data as we use our smartphones and computers. However, the volume of data that is created by modern systems is on a scale that many of us might struggle to … [Read more...]
From AI to SI: Samtec Participates on Two Upcoming Webinars
Nvidia had its annual GTC gathering of AI developers, fans, media, and gamers recently. The newly announced Nvidia Blackwell platform is scheduled for release in late 2024/early 2025. Blackwell will likely lead to another round of "world domination" - I say that tongue in cheek - for the Nvidia. One thing that struck me is the raw performance the Nvidia GPUs support. Imagine the engineering that goes into develeoping signal channels for the HBM, NVLink, PCIe, CXL, and numerous other … [Read more...]
How to Design Component Launches Faster
Designing and optimizing a breakout region (or component launch) for a connector can be challenging. It often requires multiple back and forth iterations and analysis to adjust variables. Samtec’s new SIBORGTM (Signal Integrity Breakout Region Guru) is a free tool that works with Ansys HFSS 3D Layout to generate, visualize, optimize, and develop PCB package and component breakout regions (BORs), enabling Samtec customers to design component launches faster. SIBORG was initially intended to be … [Read more...]
From Design to Production
There comes a time when every design must enter production. However, the path that any item takes from initial concept to final production is a complicated one, and it is very rare that any device makes it through this process unchanged. It would be great if there were no limits imposed by schedules or budgets. To paraphrase US soldier Hal Moore, “Unlike in baseball, three strikes and you are not out. There is always something else you can try…” Moore was talking about leadership, but the … [Read more...]
AMD XRF4 RF Accessory Kit Features Samtec Analog Over Array™ Technology
Samtec open-pin-field arrays like SEARAY™ provide designers the ability to simultaneously run differential pairs, single-ended signals, and power through the same board-to-board interconnect. This design approach allows maximum pin-selection, routing, and grounding flexibility. Additionally, Samtec open-pin-field solutions can be used to route differential or single-ended analog or RF signaling in addition to digital differential pairs, single-ended signals, and power in the same connector. … [Read more...]
15 or 60? – Leap Years Explained
A friend of mine told me his birthday was coming up. He told me it was his 15th. "What?" I thought. He's older than me. He then told me his birthday was on February 29. Duh! Now that makes sense. Leap Years! I know we have "leap years," but I could not actually remember why. Maybe I am 60, but not quite yet. Anyway, I cranked up the "Google Machine" to see what I could find. As with any Google search, you can quickly go down a rabbit hole. I guess I should have asked ChatGPT to write this … [Read more...]
Six Samtec Authors Win DesignCon Best Paper Awards
DesignCon 2024 has just announced its Best Paper Awards winners, and six Samtec authors are honored alongside their colleagues from other organizations. Somewhat unique in the world of “conference paper presentations,” DesignCon papers tend to average about 30+ pages with extensive data and research. They frequently include authors across multiple companies and/or universities, which can lead to compelling content and fascinating connections between disciplines. DesignCon Best Paper … [Read more...]
New Intel/Arrow AXE5-Eagle FPGA Dev Kit with Samtec Interconnects Ready to Ship
FPGAs are taking over the world, or it just seems that way. At least for readers of the Samtec blog. Samtec oftens gets questions as to whether we sell FPGAs or not. Of course we don't, but we do sell VITA 57.1 FMC and VITA 57.4 FMC+ interconnects found on just about every FPGA dev kit in the world. Samtec even offers a wide portfolio of FMC, FMC+ and optical module evaluation kits for real-time development and testing in a lab setting. So, the reader may ask, why does the Samtec blog … [Read more...]
COM-HPC 1.2 Specification Defines New COM-HPC Mini Form Factor
"I shall call him . . . Mini-Me." Fans of 1990s pop culture know that line forever changed the Austin Powers movie trilogy. All the same traits and qualities of the origial in one-eighth the size. Decades later, "Mini-Me" is still a part of the English lexicon. 1990s movie trilogies do not typically influence the technical development of industry standards. Yet, the latest PICMG COM-HPC 1.2 specification certainly tries. ;) A new, small form factor - COM-HPC Mini - targeted at high-growth … [Read more...]
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