Nokia Bell Labs (NBL) is leveraging Samtec glass core technology (GCT) as a platform for custom-designed silicon devices. NBL developed an electronics assembly on a glass package with multiple interconnect and chips to realize a full E-band radio on glass (RoG). To increase the reach of their E-band radio, they partnered with Northrop Grumman (NG),…
If you are new to RF and microwave engineering, take heart! If I may speak for those of us who have spent much of our career in this industry, we love it for its mystery and ever-changing demands. From my observations, there are few people who start out their engineering careers making a direct line…
Glass Core Technology (GCT) was a hot topic at IMS 2026. One reason is that Samtec GCT has evolved into heterogeneous platforms, as detailed in the brief video from our friend Shahriar Shahramian. Glass is quickly becoming recognized as a viable and vital solution in the evolution of high-performance, high-frequency connectivity due to its material…
Glass Core Technology (GCT) is Samtec’s ability to design and manufacture quick‑turn, extremely small, advanced glass interconnects that support millimeter wave frequencies through D‑band (170 GHz) and higher. To achieve this we leverage state-of-the-art, 100% in-house, semiconductor-style processing techniques including patterning circuits onto glass and formation of our patented through-glass vias (TGVs). This allows us…
High‑frequency test setups demand more than a connector that simply meets a frequency rating. Mechanical reliability, predictable and repeatable performance, and ease of use are essential, especially as designs become more challenging at 67 GHz and beyond. Samtec’s 1.85 mm 30‑degree angled launch compression mount connector (185-AL Series) is engineered with these real‑world requirements in mind. Now…
At DesignCon 26, Samtec presented live demonstrations of new products and technologies. Two that received considerable attention were a 448 Gbps Co-Packaged Copper Channel and a 130 GHz Test Platform (224/448 Gbps-capable). In the video above, Samtec’s Andrew Josephson gives a brief overview of the 130 GHz solution. We see two versions of the new…
Designing and evaluating interconnects requires broadband material characterization to determine dielectric properties. Traditional techniques used to characterize the complex permittivity and permeability of dielectrics, such as NRW and NIST, have some important limitations, such as the occurrence of air gaps and resonances in the results, which become even more challenging for broadband applications. In work…
Samtec has expanded its SMA interconnect portfolio to include new SMA edge-mount board connectors capable of reliable performance through 26.5 GHz. Traditional SMA connectors are well known for operating to 18 GHz and have been widely used for decades. However, as RF and microwave systems continue to push into higher frequencies, connector performance becomes a…
The quality of the signal looping between the PCB, test fixture, and test equipment often determines how accurately we can evaluate a device under test (DUT). As signal speeds increase, signal quality throughout the test setup becomes more important and challenging. While data speeds continue to trend upwards (there is much conversation these days about…
If there’s one thing high-frequency engineers know all too well, it’s that radio waves are fussy. When a signal operates in the gigahertz range, it becomes delicate. It demands precise timing, perfect alignment, and absolutely no unexpected delays. When several of these signals must arrive together, the challenge becomes one of synchronization. This is where…
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