We hope you can visit us at OFC, March 24-26, at the Los Angeles Convention Center. Our booth (#1849) will have two high-speed product demonstrations and onsite experts to bring you up-to-speed about several new Samtec products. Our physical product demonstrations include a FireFly™ 12 channel optical Micro Flyover™ System operating at 28 Gbps/channel (336 Gbps aggregate), and Samtec ExaMAX® backplane systems at 28 Gbps/channel (1 Tbps/connector pair) and 40 Gbps/channel (1.25 Tbps/connector … [Read more...]
Samtec Announces Hirose as Second Source for FireFly™ Micro Flyover System™
Samtec, Inc. is pleased to announce an agreement with Hirose Electric USA, Inc. as a second source for Samtec’s FireFly™ Micro Flyover System™. As a certified independent second source, Hirose can now provide its customers a future-proof inside-the-box system, as well as additional support to Samtec’s customers who use FireFly™ for current and future applications. Adam Linderman, SI Product Manager for Samtec said, “Having a dual source for FireFly™ further demonstrates Samtec’s dedication to … [Read more...]
Another DesignCon 2015 Paper – Causality Demystified (Best Paper Award Finalist)
Samtec and Teraspeed Consulting presented several papers at DesignCon 2015. One paper, "Causality Demystified," was a DesignCon 2015 Best Paper Award Finalist. Download the Causality Demystified paper from DesignCon 2015 Here's a summary if you prefer to check it out first: The quality of time domain simulation results depends on the quality of the Sparameter models used. Causality is shown to be an important parameter limiting the usefulness of a model. In this paper we demonstrate … [Read more...]
28 Gbps Backplane Demo Using Virtex UltraScale FPGAs and Samtec Backplane System
Check out this Xilinx blog post about a 28 Gbps backplane demo using two Xilinx VCU 109 eval boards talking to each other over a Samtec backplane system. This was at the Teraspeed (Samtec) booth at DesignCon 2015. Nice video! … [Read more...]
Papers, Product Demos, New Products At DesignCon 2015
Samtec, Inc., and Teraspeed® Consulting are presenting five technical papers, giving two physical high speed product demonstrations, and showcasing several new products at DesignCon 2015. Samtec’s new location is booth #943, and Teraspeed® Consulting is booth #1048. Samtec’s presentations are: Optimizing Symmetry in Open Pin Field Designs – Wednesday, January 28 – 2:50pm – 3:30pmCausality Demystified – Thursday, January 29 – 8:30am – 9:10am Teraspeed® Consulting’s presentations … [Read more...]
Samtec, FCI Sign Second Source Pact For ExaMAX
Samtec and FCI announced the signing of a second-source agreement for Samtec to manufacture, market and sell FCI’s ExaMAX® high speed backplane system. We will keep you posted as more details become available. View The Full Press Release PDF Click here for a product overview: http://samtec.com/examax … [Read more...]
Samtec Releases 2,00 mm Pitch Discrete Wire IDC With Latching Option
Samtec recently released a 2,00 mm pitch discrete wire IDC system designed for a high reliability connection and ease of discrete wire termination in field applications. Available as IDC components only, this system eliminates the expense and need for special tooling, as well as any additional cost to purchase and inventory separate parts including bodies, contacts, etc. Check out the video demonstration of the wire termination with standard flat jaw pliers. The discrete wire IDC … [Read more...]
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