Check out the new Samtec Microelectronics Technology Center Video. It’s a an overview of our microelectronics and IC packaging capabilities, including precision die attach, ultra-fine pitch and low profile wire bond, flip chip, underfill, and dam and encapsulation, complete IC-to-board design, and support and manufacturing of IC packaging, substrates, micro high density interposers and micro optical engines. Samtec’s Technology Centers develop and advance technologies and products … [Read more...]
Download Samtec’s New Augmented Reality App
Samtec Reality, the Samtec augmented reality app, is now available for free as an App Store download and is compatible with any iPad Air. This app highlights the intricate design of our ExaMAX® high-speed backplane system by examining a rich, 3D image in real-time, in your environment. Click to Download the Samtec Augmented Reality Target Image Click to Download the Samtec Augmented Reality App How Does It Work? Click on the target image above and printDownload the app from the … [Read more...]
IEEE Working Group To Define High-Speed PCB Measurements
Have you ever received a measured Touchstone file from a vendor and felt the data was bad...or at least it had obvious passivity issues? Have you wanted to measure PCB traces and needed to de-embed the launch effects and found your data suspect? Maybe you wondered if you should trust the measured connector data above 20 GHz as the calibration traces were not the best? Getting high quality measured S-parameter data of embedded microwave structures is not a trivial effort, … [Read more...]
Survey Says …
As I write this post, I’m thrilled to report that Samtec was just ranked #1 in The Bishop and Associates European Customer Survey of the Electronic Connector Industry. This is the ninth (9th) time we are #1 in the European Survey. Even though this is an accomplishment we’re incredibly proud of and honored to receive, we’re not here to be obnoxious and stroke our egos. We’re here to make your life easier and provide the best interconnect products, service and support in the industry. … [Read more...]
How To Specify High-Speed Mezzanine Connectors
Julian Ferry, Samtec’s Principle R&D Engineer, recently explained to our friends at Connector Supplier how choosing a connector for mezzanine board-to-board applications presents challenges in several engineering disciplines. Signal integrity concerns make the selection even more complex. Check out Julian’s article here. Julian discusses a variety of topics, including physical requirements, mechanical performance, considerations for high-speed data parameters such as return loss, … [Read more...]
More On 25+ Gbps Backplane Design
I recently posted a blog about videos of Teraspeed®’s Scott McMorrow explaining how he determined the materials to choose in order to achieve the best performance for a backplane system with a 25 Gbps+ operation. Xilinx’s Xcell Daily Blog also reported on these videos, and they tell us more about the setup, including eval boards used (Xilinx VCU109) and the FPGA selected (Virtex UltraScale VU095), among other details. Check out the Xilinx blog here. I encourage you to check out Xcell … [Read more...]
At What Data Rate Do You Use Photons To Push Data?
Check out this silicon photonics article in EDN – “Silicon photonics: Will the hare finally catch the tortoise?” -- by Ransom Stephens. He asks Sylvie Menezo (Director of France’s IRT Nanoelectronics Silicon Photonics Program) at what data rate do you think engineers will have to focus on designs that use photons to push data? I think it’s a great discussion and article. FYI ... Ransom Stephens’ is a technologist, science writer, novelist, and Raiders fan Electronic Design … [Read more...]
PCIe® Gen 3 Protocol Over Fiber
Samtec PCIEO Series Active Optical Cable Assemblies use a patented optical engine technology allowing low power consumption while significantly extending the PCIe® bus. These Active Optical Cable Assemblies allow new and existing PCIe® Expansion and Extension systems to extend the distance between ports up to 100 meters at Gen 3 data rates. The cable length can be easily customized with either a 100 MHz clock or with no clock. These Active Optical Cables are plug-compatible, … [Read more...]
PCB Materials For Terabit Backplane Designs
Samtec helps engineers design high performance electronic systems. With the recent integration of Teraspeed® Consulting into the Samtec family, we now provide more access to our advanced systems design research, helpful videos, conference presentations, white papers, etc. Here’s a link to two videos you should check out. Scott McMorrow, an R&D Consultant for Teraspeed® Consulting, explains how he performed extensive analyses of PCB materials for terabit backplane designs. His … [Read more...]
Direct Connect High Speed Press Fit Cable Assembly
Our new DCC Series -- direct connect cable system – is a cost-effective high speed cable solution that supports and surpasses PCIe® Gen3 speeds at 2 meters cable length. The DCC is rugged. High retention press fit pins attach directly to the PCB, eliminating the cost of the mating connector. Fortunately an extraction tool is available. The assembly also has an over-molded strain relief. The connector saves space. First, it is low profile, only 3,00 mm tall. Second, it also saves space … [Read more...]