Samtec’s AcceleRate® mP is a combo connector with both signal pins and power blades. It is a member of Samtec’s line of AcceleRate high-speed, high-density products.
Strategic advantages include:
- high-speed interconnect system
- high-density design; up to 240 I/Os in .438 square inches (283 square mm)
- power blades provide up to a 20% increase in current vs. similar blade-style pins
Design elements include:
- signal pins are rated at 56 Gbps PAM4 performance
- 10, 20, 30, and 40 positions per row
- six rows of signal pins standard (60, 120, 180, 240 pins total)
- signal pins are on .635 mm pitch
- 2, 3, 4, and 5 power blades are available
- mated stack heights: 5, 7, 9, 10, 11, 12, 14, 16 mm
- available in 10 µ” and 30 µ”Au plating in the contact areas, with matte-tin on the tails
- through-hole weld tab for increased mechanical strength to the PCB
The power blades are rotated 90 degrees in the insulator. This provides up to a 20% increase in current over similar blade-style power systems since it allows for a simpler and better path for the current to flow from the board to the connector. AcceleRate mP was designed with the BOR in mind to maximize current capabilities and minimize distribution resistance in the same form factor, while also reducing current crowding.
This blog provides more information about the AcceleRate mP’s power integrity benefits.
Availability:
- AcceleRate mP is not yet released for sale.
- Samples will be available in late Q2, 2023, and additional configurations will be approximately late 2023.
- The full release is approximately 12-18 months after first samples.
- Drawings and other specifications can be shared under NDA.
For more information, please contact Alex Wroten, High-Speed Product Manager.