Glass Core Technology (GCT) was a hot topic at IMS 2026. One reason is that Samtec GCT has evolved into heterogeneous platforms, as detailed in the brief video from our friend Shahriar Shahramian. Glass is quickly becoming recognized as a viable and vital solution in the evolution of high-performance, high-frequency connectivity due to its material…
Glass Core Technology (GCT) is Samtec’s ability to design and manufacture quick‑turn, extremely small, advanced glass interconnects that support millimeter wave frequencies through D‑band (170 GHz) and higher. To achieve this we leverage state-of-the-art, 100% in-house, semiconductor-style processing techniques including patterning circuits onto glass and formation of our patented through-glass vias (TGVs). This allows us…
Designing and evaluating interconnects requires broadband material characterization to determine dielectric properties. Traditional techniques used to characterize the complex permittivity and permeability of dielectrics, such as NRW and NIST, have some important limitations, such as the occurrence of air gaps and resonances in the results, which become even more challenging for broadband applications. In work…
Samtec has expanded its SMA interconnect portfolio to include new SMA edge-mount board connectors capable of reliable performance through 26.5 GHz. Traditional SMA connectors are well known for operating to 18 GHz and have been widely used for decades. However, as RF and microwave systems continue to push into higher frequencies, connector performance becomes a…
The embedded computing industry has reached a major milestone with the ratification of the ANSI/VITA 90 (VNX+) family of standards. Announced on February 19, 2026, by VITA, this new standard represents a significant leap forward in compact, rugged, high‑performance embedded design. Samtec interconnects were selected for the VNX+ VITA 90 standard to improve signal integrity,…
Samtec’s ADM6 and ADF6, AcceleRate® HD array connectors—known for their slim profile and high-density 0.635 mm pitch—are now available with expanded stack height options ranging from 5 mm to 16 mm and pin counts from 40 to 400 positions. The product offering expansion allows design flexibility with quick delivery, supporting applications such as datacom, high-performance…
Software defined radio (SDR) requirements are starting to exceed the performance capabilities of many traditional RF components. This challenge invites RF system architects to select connectors that were originally designed to meet the demanding signal integrity specifications of high-speed digital applications. This blog highlights some key details from a recent case study. The study explains…
Ultra-miniature and lightweight U.FL connectors originally gained popularity for their use in early, commercially available mobile phones and laptops as a way to connect internal RF modules to antennas. In those controlled environments—where the connector was installed once, had protection from the chassis, and then rarely seen again—the original U.FL connector functioned well. Fast forward…
What Are Industry Standards? Standards are all about compatibility and interoperability. End customers, especially government agencies and their primes, want standardization versus customization to bring down cost of items, improve availability and shorten lead times. Think of them as blueprints to a house, where the contractor can ensure the foundation, wiring and plumbing are well defined and…
If you’ve visited an industry trade show over the last year, chances are you’ve seen Samtec’s new orange Nitrowave™ cables in action either at a Samtec booth or one of our partners. We’ve been getting a lot of questions about the Nitrowave Microwave Cable Assemblies. I recently sat down with some members of the RF…
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